WMSIC Electronic Components

HRE CGA0603X5R475K100JT

ModelCGA0603X5R475K100JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0603X5R475K100JT
Type
HRE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0603X5R475K100JT
Electronic Component
1
Electronic Component
4.7uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264495153
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0603X5R475K100JT 贴片陶瓷电容(MLCC)产品概述

一、核心电气性能参数

CGA0603X5R475K100JT为多层陶瓷贴片电容(MLCC),核心电气参数与应用场景高度匹配:

  • 容值:4.7μF(容值代码“475”,即47×10⁵pF),满足中容量滤波、耦合需求;
  • 精度:±10%(代码“K”),覆盖一般电子电路的容值偏差要求;
  • 额定电压:10V DC(连续工作电压上限),适配3.3V、5V等主流低压系统;
  • 温度系数:X5R(符合EIA标准),工作温度范围-55℃~+85℃,容值变化≤±15%,宽温稳定性优异;
  • 附加特性:无极性设计,低等效串联电阻(ESR)、低等效串联电感(ESL),高频性能突出。

二、封装与机械规格

采用0603封装(英制代码,对应公制1608),是小型化电子设备的主流选择:

  • 尺寸:公制1.6mm(长)×0.8mm(宽),厚度约0.8mm(符合HRE芯声标准规格);
  • 引脚:2端无极性,适配自动化贴装设备;
  • 材质:多层陶瓷结构(Ni基电极),符合RoHS 2.0、REACH环保标准,不含铅、镉等有害物质。

三、产品关键特性

  1. 宽温稳定:X5R温度特性可覆盖-55℃~+85℃,容值波动小,适合户外或温差较大的应用(如智能穿戴设备);
  2. 低压适配:10V额定电压避免过压风险,精准匹配3.3V/5V系统的电源滤波、信号耦合;
  3. 小型化优势:0603封装助力产品轻薄化,适配智能手机、TWS耳机等紧凑空间设计;
  4. 高可靠性:多层陶瓷结构抗振动、抗冲击,寿命可达10⁶小时以上,符合IEC 60384-1国际标准;
  5. 环保合规:无有害物质,满足全球电子行业环保要求。

四、典型应用领域

该电容针对低压、小型化场景优化,典型应用包括:

  • 消费电子:智能手机主板电源滤波、TWS蓝牙耳机音频耦合、智能手表信号隔离;
  • 小型设备:便携式血糖仪、无线充电底座、智能手环的辅助电源稳压;
  • 通信设备:小型路由器、物联网模块的高频噪声抑制、射频信号耦合;
  • 工业控制:小型PLC、传感器模块的低压滤波回路。

五、环境适应性与可靠性

  • 工作温度:-55℃~+85℃(X5R标准范围);
  • 存储温度:-40℃~+125℃;
  • 焊接适应性:可承受回流焊(峰值260℃±5℃,时间≤10秒)、波峰焊(峰值240℃±5℃,时间≤3秒);
  • 可靠性测试:通过HRE内部高温负载寿命(125℃、10V、1000小时)、温度循环(-55℃~+85℃,500次)等测试,性能稳定。

综上,CGA0603X5R475K100JT以“宽温稳定、低压适配、小型化”为核心优势,是消费电子、小型设备等领域的高性价比MLCC选择。

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