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HRE CGA0805X5R107M6R3MT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X5R107M6R3MT
- Type
- HRE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X5R107M6R3MT
- Electronic Component
- 1
- Electronic Component
- 100uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0264495157
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X5R107M6R3MT 产品概述
一、产品简介
CGA0805X5R107M6R3MT（品牌：HRE / 芯声）是一款0805封装的多层陶瓷贴片电容，额定容量100µF，公差±20%，额定电压6.3V，介质类型为X5R。该产品面向空间受限的表贴电路，兼顾较大电容值与贴片化装配的需求，适合中低压电源旁路与去耦场合。
二、主要特性
- 容值：100µF（标称值）
- 精度：±20%（M级）
- 额定电压：6.3V DC
- 温度特性：X5R（符合X5R温度等级，常温至高温范围内性能稳定）
- 封装：0805（2.0×1.25mm 级别表贴）
- SMT 兼容，适用于卷带高速贴片生产
三、性能说明与设计注意
- 温度特性：X5R通常表示在－55°C 到 +85°C 范围内电容变化控制在一定范围（典型为±15%），对温度的稳定性较陶瓷高常数型更可控。
- 直流偏压效应：陶瓷介质在加直流电压时会出现明显的电容量下降，尤其是大容量、较小封装的器件。设计时应参考厂方的电压-容量曲线，预留裕量；如对有效电容要求严格，建议并联多个器件或选择更大封装。
- 高频特性：MLCC具有极低的ESR/ESL，适合高速去耦与射频旁路，但0805尺寸限制了单颗的能量存储与纹波处理能力。
- 寿命与可靠性：正常在额定电压、温度范围内使用可靠性高。避免超过额定温度、机械应力或重复过热。
四、典型应用场景
- 电源去耦与近端旁路（CPU、PMIC、LDO 输入/输出）
- 开关电源滤波与能量缓冲（移动设备、物联网终端）
- 消费电子、便携设备、通信模块与各类紧凑型电源模块
五、焊接与存储建议
- 推荐采用标准回流焊工艺，遵循厂方回流温度曲线，避免极端温度冲击。
- 对潮湿敏感材料，长时间暴露前建议按MSL要求烘烤处理；贴装过程中避免板弯曲或机械冲击以防裂纹。
- 采购与入库时保持卷盘包装完整，贴装前检查过期存放与吸湿状况。
六、封装与采购信息（建议）
- 标准0805贴片、适合卷带（tape & reel）供货，便于SMT自动化生产。
- 订购或设计时建议向HRE（芯声）索取完整数据手册，获取温度/电压曲线、ESR、纹波电流及可靠性试验数据，以便在目标应用中进行精确验证。
总结：CGA0805X5R107M6R3MT 为在空间受限环境下需要较大电容量的表贴解决方案，具有X5R介质的温度稳定性与MLCC的高频特性。使用时应充分考虑温度、直流偏压及封装尺寸对实际有效电容的影响，并按厂方资料进行应用验证。
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