WMSIC Electronic Components

HRE CGA1210X5R106K630RT

ModelCGA1210X5R106K630RT
Package1210
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA1210X5R106K630RT
Type
HRE
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA1210X5R106K630RT
Electronic Component
1
Electronic Component
10uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.16g
Electronic Component
1
Electronic Component
BM0264495101
Electronic Component
X5R
Voltage
63V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA1210X5R106K630RT 多层陶瓷贴片电容(MLCC)产品概述

CGA1210X5R106K630RT是HRE(芯声)品牌推出的一款中高压、中等容值的片式多层陶瓷电容(MLCC),采用1210封装,兼顾容值稳定性、电压耐受能力与成本优势,广泛应用于消费电子、工业控制、电源系统等领域。

一、产品基本定位与核心类型

该产品属于片式多层陶瓷电容(MLCC) ,通过多层陶瓷介质叠层+电极印刷工艺实现“小体积高容值”,是电子电路中最常用的无源滤波/耦合元件。型号编码明确核心特性:

  • “CGA”为HRE MLCC系列标识;
  • “1210”为英制封装规格;
  • “X5R”为温度系数;
  • “106”=10×10⁶pF=10μF(标称容值);
  • “K”=±10%(容值精度);
  • “630”=63V(额定直流电压);
  • “RT”为镀锡端电极类型。

二、核心性能参数详解

参数项 规格值 关键说明 标称容值 10μF(106) 满足中等滤波/耦合需求,覆盖常规电路 容值精度 ±10%(K级) 无需高精度校准,适配90%以上应用 额定直流电压 63V DC 持续工作电压上限,建议留20%余量 温度系数 X5R 工作温度-55℃~+85℃,容值波动≤±15% 损耗角正切(tanδ) ≤2.0%(25℃/1kHz) 低损耗,减少电路能量损耗 绝缘电阻(IR) ≥10⁹Ω(25℃/50V) 高绝缘性,避免漏电流干扰

三、封装与尺寸规格

采用1210英制封装(公制3225:3.2mm×2.5mm),适合高密度PCB贴装:

  • 长度:3.2±0.2mm;
  • 宽度:2.5±0.2mm;
  • 厚度:1.6±0.1mm(典型值);
  • 端电极:Ni/Sn镀锡层,兼容无铅回流焊,焊接可靠性高。

四、温度特性与稳定性优势

X5R温度系数是核心优势:

  • 温度范围覆盖**-55℃+85℃**,满足工业级(-40℃+85℃)和消费级(0℃~+70℃)需求;
  • 温度波动时容值变化≤±15%,远优于Y5V(±20%),避免电路性能漂移(如滤波失效、信号失真);
  • 对比X7R(-55℃~+125℃),X5R成本更低,适合无需超高温的场景。

五、典型应用场景

因性能平衡,适用于以下核心场景:

  1. 电源滤波:开关电源输出端(如DC-DC转换器),10μF滤除中低频纹波,63V适配12V/24V系统;
  2. 信号耦合:音频功放输入/输出、射频低噪放耦合,低损耗避免信号衰减;
  3. 旁路电容:微处理器、FPGA电源旁路,快速抑制噪声;
  4. 工业控制:PLC、传感器模块滤波/耦合,适应工业温度变化;
  5. 消费电子:机顶盒、显示器、智能家居电源部分,兼顾性能与成本。

六、品牌可靠性与环保认证

HRE(芯声)作为国内MLCC主流厂商,该产品通过:

  • 可靠性测试:高温寿命(125℃/63V×1000h,容值变化≤±10%)、湿度测试(85℃/85%RH×1000h)、温度循环(-55℃~+85℃×1000次),符合GJB/IPC标准;
  • 环保认证:RoHS 2.0、REACH,无铅无镉;
  • 一致性:自动化生产,参数离散性小,批量应用稳定。

七、选型与使用注意事项

  1. 电压匹配:实际工作电压≤50V(留20%余量),避免过压损坏;
  2. 温度范围:超85℃需换X7R型号;
  3. 贴装工艺:回流焊峰值温度240±5℃,时间≤10秒,防陶瓷开裂;
  4. 静电防护:MLCC敏感静电,操作需接地,用防静电工具;
  5. 精度需求:±10%适配常规应用,高精度需选“J级(±5%)”型号。

该产品凭借平衡的性能与可靠质量,成为中高压中等容值MLCC的高性价比选择,覆盖多领域电子设备设计需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.