WMSIC Electronic Components

HRE CSA0603C0G470J500JT

ModelCSA0603C0G470J500JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CSA0603C0G470J500JT
Type
HRE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CSA0603C0G470J500JT
Electronic Component
1
Electronic Component
47pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264495041
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CSA0603C0G470J500JT产品概述

一、产品简介

CSA0603C0G470J500JT为HRE(芯声)品牌的一款贴片多层陶瓷电容(MLCC),容值47pF,精度±5%(J),额定电压50V,采用C0G(亦称NP0)温度特性,封装为0603(约1.6×0.8mm)。该器件面向对温度稳定性、频率特性和介质损耗有较高要求的精密与高频电路。

二、主要参数

  • 容值:47pF
  • 精度:±5%(J)
  • 额定电压:50V DC
  • 温度系数:C0G/NP0(接近零温度系数)
  • 封装:0603(英制0603,公制约1.6×0.8mm)
  • 形态:贴片(SMD)
  • 品牌:HRE(芯声)
  • 型号:CSA0603C0G470J500JT

三、特性与优势

  • 温度稳定性高:C0G介质使电容在宽温度范围内保持稳定,适合精密时间常数和滤波电路。
  • 低损耗、低介电吸收:在高频环境下保持较高Q值,适合射频、振荡器和匹配网络。
  • 电压依赖性小:相比高介电常数陶瓷,C0G对直流偏置的容量变化极小,保证性能可预测性。
  • 小尺寸、高可靠性:0603封装适合高密度贴片组装,兼顾焊接工艺与电气可靠性。

四、典型应用

  • 射频匹配网络、谐振回路与振荡器元件
  • 精密定时、滤波、耦合/旁路电容
  • ADC/DAC参考电容与采样保持回路
  • 高频信号路径中要求低损耗的场合

五、封装与外形提示

0603为常用SMT封装,尺寸约1.6×0.8mm,厚度随厂商工艺略有差异。PCB布局时建议按制造商推荐的焊盘尺寸留足焊盘与过孔间距,以确保良好焊接与热循环可靠性。

六、可靠性与工艺建议

  • 焊接:建议使用标准无铅回流焊工艺,遵循供应商的回流温度曲线。
  • 防潮与预处理:若长时间暴露于潮湿环境或超过包装建议时间,建议按IPC/JEDEC标准进行预烘烤以防吸湿导致焊接裂纹。
  • 机械应力:贴片电容对焊接及基板弯曲较敏感,设计时应避免在元件边缘施加过大应力并优化焊盘长度以降低应力集中。
  • 储存与搬运:避免磕碰、静电与强酸碱环境,尽量在规定温湿度范围内存放。

七、选型与采购建议

在高频或精密电路中优先考虑C0G介质以保证温漂和Q值;47pF/50V为常用规格,适配多数RF与信号链需求。采购时确认批次与可追溯性,并与供应商确认封装厚度和回流参数以便于生产匹配。

如需更详细的尺寸图、回流曲线或可靠性试验数据,可联系供应商获取器件数据手册与质量证明文件。

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