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HRE CGA0805X7R102K101KT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X7R102K101KT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X7R102K101KT
- Electronic Component
- 1
- Electronic Component
- 1nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0264778621
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X7R102K101KT 产品概述
一、产品简介
CGA0805X7R102K101KT 为 HRE(芯声) 系列贴片多层瓷片电容（MLCC），规格为 0805（2012 公制）、电容值 1 nF（102）、容差 ±10%（K）、介质材料 X7R、额定电压 100 V。该器件体积小、性能稳定，适合表面贴装自动化生产，常用于去耦、滤波、耦合与定时电路。
二、主要参数
- 封装：0805（公制 2.0 × 1.25 mm）
- 容值：1 nF（102）
- 容差：±10%（K）
- 额定电压：100 V DC
- 温度特性：X7R（–55°C 至 +125°C，容值随温度变化有限）
- 极性：无极性（双端）
- 高频特性：低 ESR、低 ESL，适合高频旁路与滤波
三、性能要点与注意事项
- X7R 属于 II 类陶瓷，具有较高的体积容值，但存在温度和电压依赖性。工作温度或直流偏置较高时，实际电容可能出现一定下降，设计时请考虑 DC bias 与温漂影响。
- MLCC 本身绝缘电阻高、漏电小、寿命长，适合长期稳定运行的表面贴装场合。
- 为保证焊接可靠性与电气性能，建议采用合适的焊盘设计与回流工艺，避免过度机械应力（如夹具压迫、弯曲基板）导致裂纹。
四、典型应用
- 电源去耦与旁路（开关电源、线性稳压器）
- 高频滤波与阻抗匹配（通信模块、射频前端的旁路）
- 耦合/定时网络（信号耦合、RC 滤波器）
- 中高压电子模块（LED 驱动、电机驱动、工业电源）等场合
五、装配与焊接建议
- 推荐采用无铅回流焊工艺，遵循标准回流曲线，峰值温度控制在行业规范范围（最大约 260°C），缩短高温停留时间以降低热冲击。
- 贴装时注意元件取放方向与夹持力度，避免机械应力导致微裂。焊盘尺寸应参考厂商推荐的 PCB land pattern 以优化焊点可靠性与阻抗特性。
六、储存与可靠性
- 建议在干燥、常温、无强酸碱及腐蚀性气体环境中保存，长期储存前可按潮湿敏感等级（MSL）采取防潮包装措施。
- 使用前如经过潮湿环境暴露，应遵循烘烤回潮处理规范以防焊接时发生炸裂。
七、选型提示
- 若电路中存在高 DC 偏置或对容值稳定性要求极高，考虑增大标称电容或选用温漂更低的介质（如 NP0/C0G）或更高额定电压型号。
- 0805 尺寸兼顾体积与可焊性，如需更小封装（如 0603/0402）或更高耐压/更大容量，请与供应商沟通替代型号。
产品型号 CGA0805X7R102K101KT 表示 0805 封装、X7R 介质、1 nF、±10%、100 V 额定。若需器件样品、详细封装尺寸图或回流曲线与可靠性测试报告，可联系 HRE(芯声) 技术支持获取更详尽资料。
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