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HRE CGA0603X7R104J500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R104J500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R104J500JT
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264743627
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R104J500JT 产品概述
一、产品基本信息
CGA0603X7R104J500JT 为贴片多层陶瓷电容（MLCC），规格为 100nF（0.1µF），公差 ±5%（J），额定电压 50V，介质材料 X7R，封装尺寸 0603（1608公制，约1.6mm × 0.8mm）。品牌：HRE（芯声）。该型号适用于对体积、频率响应和温度稳定性有中等要求的一般电子设计场景。
二、电性能与温度特性
- 电容值：100nF（0.1µF），公差 ±5%。
- 额定电压：50V DC。
- 温度特性：X7R，工作温度范围 -55°C 至 +125°C；电容在此范围内的允许偏差约为 ±15%，适用于去耦、滤波和旁路等应用。
- 直流偏压效应：陶瓷介质在直流偏压下会出现电容下降，X7R 类型在高电压下可能损失部分电容值，设计时建议考虑适当降额或进行实测验证。
- ESR/ESL：MLCC 本身等效串联电阻低、等效串联电感小，适合高频旁路与快速瞬态响应需求。
三、结构与封装
- 封装：0603（1608），适合高密度表面贴装（SMT）。
- 结构：多层陶瓷堆叠，端电极可采用镀银/镀镍/镀金或其他常见工艺（实际电极处理以出厂规格为准）。
- 包装：常见为卷带（Tape & Reel），便于自动贴片，常用数量有 3,000 或 5,000 粒/卷（以订购信息为准）。
四、典型应用场景
- 电源去耦与稳压器输出旁路
- 数字/模拟芯片电源旁路与去耦
- 高频滤波、耦合/旁通网络
- 信号线旁路与射频前端去耦（视频段和需求而定）
五、使用与焊接建议
- 焊接：遵循 J-STD-020 推荐的回流焊温度曲线进行处理，避免超过规定的峰值温度与保温时间。
- PCB 贴装注意：0603 尺寸对 PCB 设计与焊盘尺寸敏感，建议采用厂家或 IPC 推荐的焊盘规格，并保证良好焊膏印刷以形成适当焊点。
- 机械应力：避免靠近 PCB 边缘、打孔或弯曲区域，以减少因板弯曲导致的裂纹风险。贴片后避免使用强力机械冲击。
- 直流降额：如电路对电容值极其敏感，建议在设计时考虑电压降额或实际测试在工作电压下的电容保持率。
六、可靠性与选型提示
- X7R 在温度稳定性和体积/电容密度之间提供折中方案；若要求极高稳定性或低温漂，应考虑 C0G/NP0；若需更大容量且可容忍温漂，可选 Y5V 等介质。
- 对于关键电源去耦，建议并联不同电容值（如 100nF 与 1µF/0.01µF）以覆盖更宽频段的去耦需求。
- 采购时请确认所需批次的包装、端电极材料及相关可靠性测试报告（如温度循环、焊接热冲击等）。
如需产品规格书（Datasheet）、封装尺寸图或样品支持，我可协助获取或提供更详细的布局建议与电气测试参考。
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