Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603C0G471J500JT是芯声电子(HRE) 推出的一款多层陶瓷电容(MLCC),型号各段含义明确:
核心基础参数清晰:
参数项 规格要求 容值 470pF 精度 ±5% 额定电压 50V DC 温度系数 C0G(±0ppm/℃) 封装 0603(1608) 品牌 HRE芯声电子该型号依托C0G介质的特性,在高精度、宽温稳定场景下表现突出,核心优势包括:
C0G温度系数的典型特性为**-55℃~125℃范围内±0ppm/℃**,容值几乎不受温度波动影响,可长期保持470pF±5%的精度,避免电路因环境温度变化出现性能漂移。
C0G介质的损耗角正切(tanδ)极低(≤0.0001@1kHz),高频下品质因数(Q值)高,适合射频、微波电路的耦合、滤波及谐振应用,可有效减少信号损耗。
0603封装尺寸紧凑(1.6mm×0.8mm,厚度约0.8mm),适配便携式设备(智能穿戴、平板)及高密度PCB贴装需求,助力产品小型化设计。
采用多层陶瓷叠层结构+无铅端接(符合RoHS标准),经芯声可靠性测试:
基于性能特点,该电容广泛适用于对精度、稳定性要求较高的领域:
CGA0603C0G471J500JT是芯声电子针对高精度、宽温稳定需求推出的高性能MLCC,凭借C0G的温度稳定性、低损耗特性及小体积优势,成为射频通信、工业控制、消费电子等领域的理想选择,可有效提升电路可靠性与稳定性。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products