Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603C0G750J500JT是HRE芯声电子推出的一款多层陶瓷电容器(MLCC),型号命名遵循行业通用规则:
该产品定位为高频稳定型MLCC,兼顾小型化与性能可靠性,适用于对容值波动、损耗敏感的电路设计。
容值为75pF,精度±5%(J档),在滤波、振荡等常规场景下可满足精度需求;若需更高精度(如±1%),需选型同系列F档产品,但本款在成本与性能平衡上更具优势。
C0G是陶瓷电容中温度稳定性最优的介质:温度系数±30ppm/℃(温度每变化1℃,容值波动≤0.003%),工作温度范围-55℃~125℃——极端环境下容值几乎无漂移,可避免电路性能波动。
表面贴装(SMD)0603封装体积紧凑,适配高密度PCB设计,广泛用于手机、可穿戴设备等小型电子终端。
符合RoHS 2.0、REACH及无卤素标准,电极采用镍基材料,介质为高纯度NP0陶瓷,避免有害物质,满足绿色制造要求。
多层介质与电极对齐度高,有效降低寄生电感(ESL)与等效串联电阻(ESR),提升高频信号传输效率。
因C0G的温度稳定性与低损耗特性,该产品主要用于:
HRE芯声对该产品完成多项可靠性测试,符合:
该产品以稳定性能、小型化设计及环保工艺,成为高频电路与小型电子设备的优选MLCC之一。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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