WMSIC Electronic Components

HRE CGA0603C0G750J500JT

ModelCGA0603C0G750J500JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0603C0G750J500JT
Type
HRE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0603C0G750J500JT
Electronic Component
1
Electronic Component
75pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265156242
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0603C0G750J500JT多层陶瓷电容器产品概述

一、产品基本信息

CGA0603C0G750J500JT是HRE芯声电子推出的一款多层陶瓷电容器(MLCC),型号命名遵循行业通用规则:

  • CGA:多层片式陶瓷电容器类型标识;
  • 0603:英制封装尺寸(对应公制1608,即1.6mm×0.8mm×0.8mm典型厚度);
  • C0G:温度系数(等效国际标准NP0,温度稳定型介质);
  • 750:容值编码(75×10⁰=75pF);
  • J:精度等级(±5%);
  • 500:额定电压(50V直流);
  • JT:HRE品牌生产工艺/批次后缀。

该产品定位为高频稳定型MLCC,兼顾小型化与性能可靠性,适用于对容值波动、损耗敏感的电路设计。

二、核心性能参数解析

1. 容值与精度

容值为75pF,精度±5%(J档),在滤波、振荡等常规场景下可满足精度需求;若需更高精度(如±1%),需选型同系列F档产品,但本款在成本与性能平衡上更具优势。

2. 温度稳定性(C0G介质)

C0G是陶瓷电容中温度稳定性最优的介质:温度系数±30ppm/℃(温度每变化1℃,容值波动≤0.003%),工作温度范围-55℃~125℃——极端环境下容值几乎无漂移,可避免电路性能波动。

3. 电气特性

  • 额定电压:50V DC,建议实际应用降额至40V以内(延长寿命);
  • 损耗角正切(tanδ):典型值≤0.15%(1kHz/25℃),低损耗减少高频信号衰减;
  • 绝缘电阻:≥10¹⁰Ω(25℃/50V),无漏电流干扰电路稳定性。

三、封装与工艺特点

1. 0603小型化封装

表面贴装(SMD)0603封装体积紧凑,适配高密度PCB设计,广泛用于手机、可穿戴设备等小型电子终端。

2. 环保无铅工艺

符合RoHS 2.0、REACH及无卤素标准,电极采用镍基材料,介质为高纯度NP0陶瓷,避免有害物质,满足绿色制造要求。

3. 高精度叠层技术

多层介质与电极对齐度高,有效降低寄生电感(ESL)与等效串联电阻(ESR),提升高频信号传输效率。

四、典型应用场景

因C0G的温度稳定性与低损耗特性,该产品主要用于:

  1. 高频振荡电路:晶体振荡器(XO)、压控振荡器(VCO),保证振荡频率精度;
  2. 射频(RF)前端:蓝牙、WiFi模块的滤波/匹配网络,减少信号衰减;
  3. 时钟电路:CPU、FPGA的时钟参考电路,避免容值波动导致时钟偏移;
  4. 小型电子设备:手机主板、智能手表的电源滤波与信号耦合;
  5. 工业控制:PLC、传感器模块的低噪声滤波,适应宽温度范围。

五、可靠性与合规性

HRE芯声对该产品完成多项可靠性测试,符合:

  • 环境测试:85℃/85%RH湿热、-55℃~125℃温度循环、10G/2000Hz振动测试;
  • 电气寿命:125℃/50V/1000h后,容值变化≤±2%,绝缘电阻≥10⁹Ω;
  • 合规认证:CE、UL认证,满足全球市场准入要求。

六、选型与替换参考

1. 同参数替换型号

  • 村田:GRM1885C1H750JA01D;
  • TDK:C1608C0G1H750J;
  • 三星:CL06C0G750J500NC。

2. 选型注意事项

  • 若需100V电压,切换至CGA0603C0G750J100JT;
  • 汽车电子场景需确认AEC-Q200认证(本款默认民用/工业级);
  • 精度升级至±1%需选F档(如CGA0603C0G750F500JT)。

该产品以稳定性能、小型化设计及环保工艺,成为高频电路与小型电子设备的优选MLCC之一。

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