Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRE CGA0603X7R474K500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R474K500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R474K500JT
- Electronic Component
- 1
- Electronic Component
- 470nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495158
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R474K500JT 产品概述
一、主要参数概览
CGA0603X7R474K500JT（品牌：HRE/芯声）是一款0603封装的多层陶瓷电容，主要参数如下：
- 容值：470nF（474表示0.47µF）
- 精度：±10%（K）
- 额定电压：50V
- 温度系数/材质：X7R（-55°C 至 +125°C，±15%）
- 封装：0603（约1.6mm × 0.8mm）
该型号适用于对体积和焊接可靠性有要求的中高压旁路、滤波与耦合场合。
二、材料与电气特性
X7R为高介电常数陶瓷介质，具有在宽温区间内较好的电容稳定性（通常在-55°C到+125°C范围内变化不超过±15%）。相对于C0G/NP0，X7R允许更高的容值密度，但存在非线性特性：
- 温度漂移：受控但存在，适合旁路与去耦；
- 直流偏置效应（DC bias）：随着施加直流电压，电容值会下降，接近额定电压时降幅可能明显——设计时应参考厂方DC bias曲线；
- ESR/ESL：小封装下ESR和ESL较低，适合高频去耦，但具体频率响应需参考阻抗曲线。
三、典型应用场景
- 电源去耦与滤波：USB、通信、电源管理芯片的中高频去耦；
- 模拟前端的旁路与稳定电路；
- DC-DC转换器输入/输出滤波、整流后旁路；
- 非精密定时/耦合电路（需容值稳定性的场合建议选择C0G）。
注意：在精密滤波或温度/电压敏感的时间常数电路中，X7R的非线性可能影响精度。
四、封装与焊接注意事项
- 0603体积小，布线与焊盘设计要对称，焊膏量要均衡以减少烫石（tombstone）风险；
- 建议留有足够的焊盘过渡长度和焊盘间距，避免在封装端部产生应力集中；
- 遵循厂方回流焊建议与J-STD-020等行业规范，控制峰值温度和升降温速率；
- 贴装位置避免靠近印制板边缘或频繁受弯曲区域，以减少机械应力导致的裂纹或失效。
五、可靠性与工程注意
- 常规可靠性测试包含外观、温度循环、湿热试验、耐电压与绝缘电阻测试；
- 长期工作在高偏压、高温或高湿环境时，应考虑电压降额与温升影响；
- 设计时如对有效电容有严格要求，请查阅厂方的温度-电压-频率特性曲线并进行实测验证。
六、选型建议与替代
- 若需要更高稳定性或低偏置效应，建议考虑C0G/NP0系列；
- 同规格（0603、474、50V、X7R）在Murata、TDK、Samsung等厂商均有对应产品，选型时对比DC bias曲线、阻抗特性与寿命测试结果；
- 零件编号末尾“JT”等为厂方包装/工艺编码，具体含义以厂方资料为准。
如需用于具体电路或要获取完整的电气特性曲线、封装尺寸与回流焊工艺建议，可提供电路应用场景，我可帮您做更详细的选型与布局建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
