WMSIC Electronic Components

HRE CGA0805X5R106K500MT

ModelCGA0805X5R106K500MT
Package0805
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0805X5R106K500MT
Type
HRE
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0805X5R106K500MT
Electronic Component
1
Electronic Component
10uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.042g
Electronic Component
1
Electronic Component
BM0264495150
Electronic Component
X5R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0805X5R106K500MT 产品概述(HRE 芯声)

一、产品简介

CGA0805X5R106K500MT(HRE/芯声)为贴片多层陶瓷电容(MLCC),额定容量10µF,公差±10%,额定电压50V,介质类型X5R,封装0805(约2.0×1.25mm)。该器件为通用型高容值陶瓷电容,适用于对体积、容值与电压综合要求较高的设计场景。

二、主要参数

  • 容值:10µF(标称)
  • 精度:±10%
  • 额定电压:50V DC
  • 介质:X5R(温度范围 -55℃ ~ +85℃,温度引起的容量变化典型在±15%级别)
  • 封装:0805(尺寸约2.0×1.25mm,高度与厂商有关)
  • 引脚形式:表面贴装(SMD),常见卷带(Tape & Reel)供货

三、性能特点与工程注意事项

  • X5R为高介电常数陶瓷,单位体积容值高,适合去耦与滤波。但具有明显的直流偏置效应:在施加直流电压时实际有效容值会降低,降幅与电压与厚度相关,设计中需考虑在工作电压下的实际容量。
  • 温度特性:在额定温度范围内容量有一定变动,若需高稳定性请考虑C0G/NP0类。
  • ESR/ESL:0805尺寸限制了最低ESR与ESL,适用于去耦与中高频滤波,但不等同于专用低ESR铝电解或钽电容。
  • 焊接与可靠性:遵循无铅回流焊曲线(最高峰值温度按厂家建议),避免PCB弯曲或机械应力集中,防止热循环或过度翻焊。

四、典型应用

  • 电源去耦、稳压器输出与输入滤波(DC-DC、LDO)
  • 模拟/数字混合电路的旁路与去耦
  • 工业电源、LED驱动、电机控制等中高电压场合
  • 尺寸受限的消费类与通信设备电源滤波

五、封装、采购与测试建议

  • 交货形式多为卷带(标准Tape & Reel),适配自动贴装;请向供应商确认最小起订量与包装规格。
  • 采购时确认材料批次、老化与可靠性测试(温度循环、湿热、焊接可承受性等)。
  • 选型时建议在目标工作电压下验证实际容值、ESR与失真,并在关键电源点做电路板级验证。

六、选型提示

若电路对容量稳定性与温漂敏感,应评估是否替换为更稳定的介质(如C0G)或并联多种电容以兼顾低频储能与高频去耦。对于需更高纹波电流或更低等效串联电阻的场合,可考虑封装更大或专用电解/钽电容。购买时如需替代件,请向HRE/芯声或代理商索取等效型号与数据手册以确认性能匹配。

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