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HRE CGA0805X5R476M6R3MT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X5R476M6R3MT
- Type
- HRE
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X5R476M6R3MT
- Electronic Component
- 1
- Electronic Component
- 47uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±20%
- Electronic Component
- 0.045g
- Electronic Component
- 1
- Electronic Component
- BM0264778592
- Electronic Component
- X5R
- Voltage
- 6.3V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X5R476M6R3MT 产品概述
一、概述
CGA0805X5R476M6R3MT 为 HRE(芯声) 推出的贴片多层陶瓷电容（MLCC），额定容量为 47µF，公差 ±20%，额定电压 6.3V，温度特性为 X5R，封装尺寸 0805（2.0×1.25mm 级别）。该系列以体积小、容值相对较大、适合表面贴装工艺为特点，适用于对体积与去耦性能有要求的便携式与消费电子产品。
二、主要参数
- 容值：47µF
- 公差：±20%
- 额定电压：6.3V
- 温度特性：X5R（中等温度稳定性与容值保持）
- 封装：0805（SMD）
三、性能特点
- 高容值：在 0805 小型封装下实现 47µF 的容量，适合对空间敏感但需较大旁路/滤波容量的电路。
- 稳定性平衡：X5R 温度系数在常用工作温度范围内能保持较好的容值，但仍存在温度与偏压引起的容量变化，适合非高精度定容场合。
- 良好抗直流偏置特性：相较于温度补偿型陶瓷（如 NP0/C0G），X5R 在直流偏置下容量会有下降，设计时需考虑此因素。
- 适配自动化贴片与回流焊工艺，可靠性满足常见电子产品应用需求。
四、典型应用场景
- 电源旁路与去耦（手机、平板、蓝牙耳机等便携设备）
- DC-DC 降压/升压转换器的输入/输出滤波
- 模拟电路电源滤波与储能
- 对体积有严格限制的嵌入式系统与可穿戴设备
五、选型建议
- 考虑直流偏置：若工作电压接近额定 6.3V，实际有效容量会显著下降，建议预留裕量或选更高额定电压的器件。
- 温度与频率影响：在高温或高频应用中，X5R 的有效容量与损耗可能变化，关键场合建议进行实测验证。
- ESR/ESL 需求：若电路对等效串联电阻或电感敏感，应结合厂商数据手册选型或选择专用低ESR MLCC。
六、焊接与可靠性要点
- 遵循厂商回流焊工艺曲线，避免超过推荐峰值温度与时间。
- 储存与贴装前注意防潮处理，高容值 MLCC 对湿度及回流时的吸湿性敏感，必要时进行干燥烘烤。
- 板弯曲敏感：大温差或不当的基板布局可能引起器件受力而导致裂纹，应优化焊盘与走线减少应力集中。
七、封装与替代型号
0805 封装便于高密度贴片生产。市面上其它品牌也有相同规格（47µF、6.3V、X5R、0805）的 MLCC，可作为替换，但应核对直流偏置曲线、温度特性及可靠性数据以确保兼容。
八、注意事项与存储
- 运输与储存避免潮气与高温，建议按厂家说明进行干燥桶（或防潮箱）保存。
- 安装时避免过度机械应力，焊接后避免使用超出器件额定温度与电压的工况。
- 关键项目建议向供应商索取详细数据手册与可靠性报告，并在样机阶段进行实测验证。
如需该型号的完整电气参数曲线（温度响应、DC-bias 曲线、典型 ESR/ESL 等）或推荐回流曲线与封装尺寸图，我可以协助向供应商数据手册对照并提取关键资料。
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