Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HRE CGA0603X7R224K250JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R224K250JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R224K250JT
- Electronic Component
- 1
- Electronic Component
- 220nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495149
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R224K250JT 产品概述
一、产品简介
CGA0603X7R224K250JT（品牌：HRE/芯声）为贴片陶瓷多层电容（MLCC），容值为220nF（0.22μF），精度±10%，额定电压25V，温度特性采用X7R介质，0603（1608公制）封装。该器件体积小、容量适中，适用于空间受限的表面贴装电路，常用于去耦、滤波、旁路与耦合等用途。
二、主要参数
- 容值：220nF（0.22μF）
- 精度：±10%（K）
- 额定电压：25V DC
- 温度特性：X7R（-55°C～+125°C，典型温度依赖内阻容变化范围）
- 封装：0603（1.6 mm × 0.8 mm）
- 类型：MLCC 多层陶瓷电容
三、特性与优势
- 体积小、容量相对较大：在0603小尺寸下实现220nF，适合高密度布板。
- X7R介质平衡稳定性与容值密度：相比NP0更高的容值密度，同时在宽温区间保持相对稳定的电容量。
- 良好的ESR/ESL特性：适合电源去耦与高频滤波应用，能有效抑制电源噪声。
- 适配自动化贴装工艺：SMT 兼容，便于高速贴装与回流焊接。
四、典型应用场景
- 电源去耦与旁路：USB、MCU、电源模块等局部滤波。
- 高频滤波与信号耦合：通信模块、射频前端的旁路/去耦（视频率与性能需求选择）。
- 模拟电路与采样前端：在对容值稳定性要求不极端苛刻的场合作为耦合电容或滤波电容使用。
- 移动设备、消费电子、工业控制与物联网终端等。
五、使用与焊接建议
- 回流焊兼容：推荐遵循常规无铅回流工艺规范，参照厂商回流曲线进行峰值温度和加热/冷却速率控制。
- 防裂措施：陶瓷电容脆性较高，贴装与波峰/回流焊过程中避免剧烈机械应力；在设计时留意焊盘尺寸与焊膏用量，避免过量焊膏导致应力。
- 去耦布局：尽量将电容靠近器件电源引脚放置，减小焊盘与走线的寄生电感与电阻。
六、储存与可靠性
- 储存环境：建议干燥、常温环境存放，避免潮湿与极端温度；长期存放建议遵循元件出厂包装与回流焊前的干燥处理规范。
- 可靠性：正常使用条件下具有较长寿命与良好电气稳定性；在高温高压或频繁热循环环境中，容值可能会产生随时间的微小漂移，应在设计中留有余量。
七、封装与订购信息
- 封装形式：卷带包装，适配贴片机自动生产（具体卷带数量与包装形式请参见供应商说明）。
- 型号标识：CGA0603X7R224K250JT（请以供应商或数据手册最终标注为准）。
- 选型建议：在对温漂、稳定性、寿命或高频特性有更严格要求时，可对比X7R与其他介质（如NP0、C0G、X5R等）以确定最优方案。
如需完整数据手册（详细极限参数、老化特性、回流曲线、可靠性测试报告及封装图），建议向HRE/芯声或授权代理商索取原厂资料以便在设计与生产中参考。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
