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HRE CGA0805X7R105K250KT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X7R105K250KT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X7R105K250KT
- Electronic Component
- 1
- Electronic Component
- 1uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0264495124
- Electronic Component
- X7R
- Voltage
- 25V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X7R105K250KT 产品概述
一、产品简介
CGA0805X7R105K250KT 是 HRE（芯声）系列的一款贴片多层陶瓷电容，标称容值 1 µF，公差 ±10%（K），额定电压 25 V，介质材料为 X7R，封装尺寸为 0805（2012 公制）。该型号在体积、容值与耐温性能之间取得平衡，适合常见的去耦、滤波与能量旁路应用。
二、主要电气参数
- 容值：1 µF（标称）
- 公差：±10%（K）
- 额定电压：25 V DC
- 温度特性：X7R（工作温度范围约 −55°C 至 +125°C，温度范围内电容量变化通常在 ±15% 之内）
- 封装：0805（2.0 × 1.25 mm）
三、产品特性与优势
- 体积小、容值高：0805 尺寸在有限 PCB 面积上提供 1 µF 容量，利于高密度布局。
- 温度稳定性好：X7R 介质在宽温区间保持较稳定电容，适用于大多数民用与工业应用。
- 良好电气特性：低等效串联电阻（ESR）与低等效串联电感（ESL），有助于改善高频去耦效果。
- 可靠性：采用多层陶瓷工艺，适配常规回流焊工艺，长期可靠性良好。
四、典型应用场景
- 电源去耦与旁路（DC-DC 转换器输入输出滤波）
- 模拟电路耦合/滤波网络
- 数字电路的电源稳定与噪声抑制
- 消费电子、通信设备、测量仪器等对体积与性能有权衡需求的场合
五、使用建议与注意事项
- 焊接：建议采用标准回流焊工艺，遵循器件制造商的回流曲线（峰值温度与时间受焊膏与基板影响），避免超温或长时间高温暴露。
- 机械应力：贴片陶瓷电容对机械应力敏感，焊接前后避免在器件两端施加过大剪切力或弯曲基板。
- 温度与偏压效应：X7R 在高偏压或高温条件下会出现电容量下降，设计时应预留裕量，必要时选择更高额定电压或其他介质。
- 存储：按行业湿敏等级和包装要求存放，湿敏元件在长时间暴露后需按规范烘烤处理。
六、包装与认证
- 包装形式：常见为卷带盘带（Tape & Reel），便于自动贴装。
- 环保要求：符合常见 RoHS 限制和无铅工艺要求（具体认证请以出货证书为准）。
如需样品、完整数据手册（含电气等效电路、频率特性、温度/偏压曲线、回流曲线及可靠性试验数据），或大批量询价与可用性信息，请提供用途与订货数量，便于推荐最合适的备货方案。
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