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HRE CSA0603C0G200J500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0603C0G200J500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0603C0G200J500JT
- Electronic Component
- 1
- Electronic Component
- 20pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264495047
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0603C0G200J500JT 产品概述
一、产品简介
CSA0603C0G200J500JT 是 HRE(芯声) 推出的一款高稳定性贴片多层陶瓷电容（MLCC），标称容值 20 pF，公差 ±5%（J），额定电压 50 V，采用 C0G（又称 NP0）一类温度特性，封装为 0603（约 1.6 mm × 0.8 mm）。该器件定位于对温漂、线性度和高频性能有较高要求的精密电路。
二、主要参数
- 容值：20 pF
- 精度：±5%（J）
- 额定电压：50 V
- 温度系数：C0G（极低温漂、近似零温度系数）
- 封装：0603（1608 公制）
- 尺寸：约 1.6 × 0.8 mm
三、性能特点
- 温度稳定性优异：C0G 材料使电容在宽温区间内容值变化极小，适合高精度时钟、滤波与定时电路。
- 损耗低、Q 值高：介质损耗小，适合射频电路、匹配网络及高频信号路径。
- 介电吸收低、线性好：在精密模拟和采样电路中表现稳定可靠。
- 适合表面贴装与回流焊工艺，易于自动化装配。
四、典型应用
- 高频滤波与阻抗匹配（RF 前端、射频模块）
- 时钟振荡器与频率控制电路（晶振负载、时钟网络）
- 精密模拟电路（采样、运放回路、ADC 前端）
- 通信设备、测量仪器以及汽车电子（非强制安全关键位）
五、封装与可靠性
0603 小型封装兼顾体积与可靠性，适用于高密度 PCB 布局。器件可承受常规回流焊温度曲线，建议遵循厂商回流焊与焊盘设计指南以确保贴片可靠性。HRE 提供成卷贴带供自动贴装，便于批量生产。
六、选型建议与注意事项
- 若电路对温漂与线性有更严格要求，可优先选择 C0G 材料；需更大容量或更高耐压时，考虑更大封装或不同等级产品。
- 在高湿或极端机械应力环境下，参考厂商可靠性试验数据并在布局时采取减震与应力缓解措施。
- 购买与使用前建议向供应商索取完整规格书（包括温度范围、寿命测试与包装信息）以满足特定应用需求。
如需规格书、封装图或供货与报价信息，我可协助进一步查询与整理。
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