WMSIC Electronic Components

HRE CGA1206X7R226K160NT

ModelCGA1206X7R226K160NT
Package1206
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA1206X7R226K160NT
Type
HRE
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA1206X7R226K160NT
Electronic Component
1
Electronic Component
22uF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.047g
Electronic Component
1
Electronic Component
BM0264495104
Electronic Component
X7R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
2000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA1206X7R226K160NT 贴片多层陶瓷电容(MLCC)产品概述

一、产品基本属性与型号解析

CGA1206X7R226K160NT是HRE芯声品牌推出的通用型贴片多层陶瓷电容(MLCC),型号各字符对应核心参数:

  • CGA:HRE品牌下的中低端通用MLCC系列代号;
  • 1206:英制贴片封装尺寸(长1.2英寸×宽0.6英寸,对应公制3.2mm×1.6mm),适配主流SMT自动贴装设备;
  • X7R:EIA标准温度系数代码(X=-55℃低温极限,7=125℃高温极限,R=容值变化±15%以内);
  • 226:容值代码(前两位22,第三位6代表10⁶,即22×10⁶pF=22μF);
  • K:精度代码(EIA标准,K=±10%);
  • 160:额定电压(16×10⁰=16V);
  • NT:后缀(无铅环保标识,符合RoHS、REACH指令)。

基础参数汇总:

项目 规格 容值 22μF 精度 ±10% 额定电压 16V(直流) 温度系数 X7R(-55℃~125℃) 封装 1206(3.2mm×1.6mm) 品牌 HRE芯声 环保认证 RoHS、REACH

二、核心性能特点

  1. 宽温下容值稳定
    X7R介质是MLCC中“平衡容值与温漂”的主流选择:在-55℃~125℃范围内,容值变化不超过±15%,远优于Y5V介质(温漂可达±82%),适合户外设备、工业环境等宽温场景。

  2. 精度与成本兼顾
    ±10%精度满足90%以上常规电路需求(如电源滤波、信号耦合),相比±5%精度的电容成本降低约20%,适合批量应用。

  3. 封装可靠性高
    1206封装采用无铅陶瓷-金属电极结构,焊接兼容性好(回流焊峰值温度230~250℃,时间≤30s),抗机械应力能力优于小封装(0603),适合振动环境(如车载二级电路)。

  4. 低压场景适配性强
    16V额定电压覆盖5V/12V低压系统(如消费电子、小型工业电源),实际工作电压建议控制在12.8V以内(80%降额),可延长寿命至10万小时以上(25℃环境)。

三、典型应用场景

  1. 消费电子领域

    • 智能手机/平板:电池管理系统(BMS)的DC-DC转换滤波、音频耦合电容;
    • 电视/显示器:背光驱动电路的低频纹波滤波、信号旁路;
    • 小家电:洗衣机、空调的控制板电源滤波。
  2. 工业控制设备

    • PLC(可编程逻辑控制器):输入输出模块的信号去耦、传感器接口滤波;
    • 小型工业电源:12V输出端的滤波电容,减少电压波动。
  3. 车载二级电路

    • 车载多媒体:中控屏电源滤波、蓝牙模块信号旁路;
    • 仪表盘:背光电路的稳压滤波(注意:不适合发动机舱等高温核心区域)。
  4. 通信设备

    • 路由器/交换机:电源模块的EMI滤波、射频前端的中低频旁路电容(<100MHz场景)。

四、选型与使用注意事项

  1. 温度适配
    避免在125℃以上长期工作(如发动机舱),否则容值漂移会超差;低温-55℃以上无性能衰减。

  2. 高频场景限制
    1206封装的寄生电感约1nH,适合中低频(<100MHz)应用;若需高频(>100MHz),建议选0603小封装。

  3. 焊接工艺
    禁止手工焊接(易过热损坏陶瓷介质),需采用回流焊,温度曲线需符合MLCC标准(预热150180℃,峰值230250℃,过温时间≤30s)。

  4. 储存与开封
    常温(25℃±5℃)、干燥(相对湿度≤60%)环境储存,开封后建议12个月内用完,避免吸潮导致焊接时“爆浆”。

五、品牌与品质保障

HRE芯声是国内专注于MLCC研发生产的品牌,产品通过ISO9001质量认证,符合RoHS2.0、REACH SVHC标准;CGA系列针对中低端市场,兼顾性能与成本,批量采购交货周期稳定(通常7~15天),适合中小制造企业。

该产品是低压电路中“滤波、耦合、旁路”场景的高性价比选择,可替代同类进口品牌(如村田GRM188R61C226KA73D),降低采购成本30%左右。

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