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HRE CGA0603X7R333K500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R333K500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R333K500JT
- Electronic Component
- 1
- Electronic Component
- 33nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264778598
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R333K500JT 产品概述
一、产品简介
CGA0603X7R333K500JT（品牌：HRE/芯声）为0603封装表面贴装MLCC，标称容值33nF（33NF），容差±10%（K），额定电压50V，介质材料为X7R。该器件面向中高频滤波、去耦与旁路应用，兼顾体积与电容密度，适合消费电子、通信、电源模块及一般工业控制板级滤波设计。
二、主要参数
- 容值：33 nF
- 容差：±10%（K）
- 额定直流电压：50 V
- 介电材料：X7R（温度范围典型 -55°C ～ +125°C，温度依赖性容值变化上限约±15%）
- 封装：0603（公制约1.6 × 0.8 mm）
- 封装形式：SMD 卷带供货（常见）
- 品牌：HRE（芯声）
三、性能特点
- 体积小、容量密度高，适合空间受限的贴片设计。
- X7R类介质在宽温度范围内提供中等稳定性，适用于一般电源去耦与旁路（非高精度时间基准场合）。
- 低寄生电感与低等效串联电阻（ESR），在中高频去耦效果良好。
- 对直流偏压存在容值衰减现象，设计时需考虑实际偏压下的有效容值。
四、典型应用
- 电源去耦与旁路（CPU、PMIC、放大器供电）
- 滤波与EMI抑制（输入滤波、输出滤波）
- 信号链旁路/耦合（非高精度定时电路慎用）
- 便携设备、通信模块、消费类电子和工业控制板级电容网络
五、封装与焊接建议
- 物理尺寸：0603（约1.6 × 0.8 mm），针对贴片机与回流焊工艺优化。
- 推荐焊接工艺：遵循J-STD-020回流曲线，峰值温度与时间以器件规格书为准（常见峰值约250–260°C，短时）。
- 布局建议：将电容尽量置于需去耦器件电源引脚与地之间，缩短走线，增大焊盘过孔的焊点面积以降低寄生阻抗。
- 降额建议：X7R类MLCC在高偏压下容值会下降，设计时建议对偏压进行降额评估并在样片上做实际DC-bias测试（常见工程实践中按50%～80%范围评估）。
六、选型与替代建议
- 若需更稳定的温度特性或高精度电容，建议考虑C0G/NP0类陶瓷或薄膜电容替代。
- 同等规格的替代器件可在其他厂商的0603 X7R 33nF/50V系列中寻找，选型时比较DC-bias曲线、ESR/ESL与封装一致性。
七、可靠性与储存
- X7R可在-55°C至+125°C范围内工作，但长期可靠性与寿命受工作电压、温度和机械应力影响。
- 储存应避免潮湿、高温及强酸碱环境，贴片前采用适当干燥与回流前烘烤（如潮湿等级要求）以防焊接缺陷。
- 交付通常为卷带盘装，适配SMT自动化生产。
如需更详细的电气特性曲线（温漂曲线、DC-bias特性、频率响应、ESR/ESL数据）和回流曲线，请提供需求，我可协助查找或整理规格书中的关键图表供设计验证使用。
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