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HRE CGA0603X7R681K500JT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R681K500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R681K500JT
- Electronic Component
- 1
- Electronic Component
- 680pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264778635
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R681K500JT 产品概述
一、产品简介
CGA0603X7R681K500JT（品牌：HRE/芯声）为0603封装多层陶瓷电容器，标称容量680pF（代码681），精度±10%（K），额定电压50V，介质材料为X7R。属于通用型片式电容，体积小、性能稳定、适合表面贴装生产。
二、主要参数
- 容值：680 pF
- 精度：±10%（K）
- 额定电压：50 V DC
- 温度系数/介质：X7R（-55°C 至 +125°C，典型容量变化在±15%范围内）
- 封装：0603（1608公制）
三、封装与外形
0603小尺寸设计，适合高密度贴片电路。尺寸小带来布板空间优势，同时在自动贴片与回流焊工艺下具有良好贴装一致性。常见包装为卷带（Tape & Reel），便于SMT自动化生产。
四、电气与材料特性
X7R为二类介质，具有较好的体积电容比和中等温度特性，适合去耦、滤波等用途。与C0G/NP0相比，X7R在温度、电压下的容量变化更大；在较高直流偏置下（靠近额定电压）电容会明显下降，应参考厂商的Bias曲线做设计余量。MLCC本体呈低ESR、低ESL特性，适合高频信号处理和去耦应用。
五、典型应用
- 去耦/旁路电容（中低频）
- 滤波与耦合网络
- 高频信号路径的旁路与阻尼
- 消噪、EMI抑制
不推荐用于对温度与电压系数敏感的精密振荡或定时电路（此类场合建议使用C0G/NP0类陶瓷）。
六、设计与选型建议
- 考虑直流偏置与温度漂移，必要时在额定电压下留出裕度或选用更高额定电压/更稳定介质。
- 若电路对容值精度和温漂要求严格，应选C0G类。
- 关注封装下电容随应力（焊接、PCB弯曲）导致的裂纹风险，避免在焊盘设计上形成高机械应力集中。
七、焊接与可靠性提示
推荐采用标准回流焊工艺，遵循JEDEC温度曲线；使用前做好干燥烘烤处理以防吸湿（视MSL等级）。焊接后避免强烈机械应力、避免在高温高湿长期工作环境下超出介质规格，厂商常提供可靠性试验数据（焊接热冲击、湿热和寿命测试），建议批量采购前确认QA报告。
八、替代与比对
功能等效可参考其他厂家同规格0603 X7R 680pF ±10% 50V型号，但不同厂商在Bias曲线、ESL/ESR与可靠性测试上有差异，实际替换前建议对照数据手册并进行样机验证。
九、包装与订购
常见包装形式为卷带（5000/10000粒/卷随厂商而定），订购时请确认完整料号（含封装、容值、精度、电压和包装后缀）及可追溯的质量文件，以保证生产一致性与可追踪性。
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