Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA1210X5R226K160RT 为 HRE(芯声)系列多层陶瓷电容,额定容值 22 µF,标称精度 ±10%(K),额定工作电压 16 V,温度特性为 X5R,封装规格为 1210(约 3.2 × 2.5 mm)。该器件以体积小、容值大、ESR 低为特点,适用于电源去耦与旁路、储能和滤波等场合。
X5R 为钛酸钡基陶瓷介质,具有较高的比容和良好的体积利用率,能在中等温度范围内保持相对稳定的电容量。与 NP0/C0G 类相比 X5R 温度稳定性较差,不适用于高精度时基或滤波电路,但在电源旁路与去耦中可提供更高的电容量密度。
在选型时,应结合工作温度、直流偏压、纹波电流与可靠性要求审查厂方详尽数据(如电容随电压/温度的变化曲线、额定纹波电流、热阻等)。若需更高温度稳定性或更小的偏置损失,可考虑改用 C0G/NP0(精密)或更大封装/不同介质的器件;若需更高能量缓冲或纹波承受能力,可与电解或钽电容并联使用。
如需进一步的电气参数曲线、焊接规范或 PCB 尺寸建议,可提供要求,我将基于 HRE 官方资料给出更详尽的指导。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products