WMSIC Electronic Components

HRE CGA1210X5R226K160RT

ModelCGA1210X5R226K160RT
Package1210
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA1210X5R226K160RT
Type
HRE
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA1210X5R226K160RT
Electronic Component
1
Electronic Component
22uF
Package
1210
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.143g
Electronic Component
1
Electronic Component
BM0264778625
Electronic Component
X5R
Voltage
16V
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA1210X5R226K160RT 产品概述

一、产品简介

CGA1210X5R226K160RT 为 HRE(芯声)系列多层陶瓷电容,额定容值 22 µF,标称精度 ±10%(K),额定工作电压 16 V,温度特性为 X5R,封装规格为 1210(约 3.2 × 2.5 mm)。该器件以体积小、容值大、ESR 低为特点,适用于电源去耦与旁路、储能和滤波等场合。

二、主要规格参数

  • 容值:22 µF(标称)
  • 精度:±10%(K)
  • 额定电压:16 V DC
  • 温度特性:X5R(按 IEC 标准,-55°C 至 +85°C 范围内电容变化 ≤ ±15%)
  • 封装:1210(英制 0.12"×0.10",公制约 3.2×2.5 mm)
  • 品牌:HRE(芯声)

三、材料与温度特性

X5R 为钛酸钡基陶瓷介质,具有较高的比容和良好的体积利用率,能在中等温度范围内保持相对稳定的电容量。与 NP0/C0G 类相比 X5R 温度稳定性较差,不适用于高精度时基或滤波电路,但在电源旁路与去耦中可提供更高的电容量密度。

四、性能与工程注意事项

  • DC 偏置效应:高介电常数材料在施加直流偏压时电容会明显下降,应在设计时参考厂方数据曲线并适当预留裕量。
  • ESR 与纹波:MLCC 型电容 ESR 很低,适合高频去耦与快速瞬态抑制,但在高纹波电流或能量缓冲场合需关注发热与等效串联电阻影响,必要时并联多个器件或选用专用电解/钽电容。
  • 机械强度:1210 封装在波峰或回流焊时抗应力能力有限,焊接与贴装工艺不当可能导致裂纹导致失效。

五、封装与装配建议

  • 推荐参考厂家提供的焊盘尺寸与过孔布局,保证良好焊点与应力分散。
  • 采用符合 J-STD-020 的无铅回流曲线(最高峰值温度遵循厂方要求,通常 ≤ 260°C)。
  • 避免在 PCB 上对焊盘施加过大机械应力,贴片后减少拆装与弯曲;对于可能受机械振动或冲击的应用,考虑环氧点固或机械支撑。

六、典型应用场景

  • 各类电源模块的输入/输出去耦与旁路
  • DC-DC 转换器及稳压电路的输出滤波
  • 消费电子、通信设备与工业控制中对体积/容值比要求高的场合

七、选型与替代建议

在选型时,应结合工作温度、直流偏压、纹波电流与可靠性要求审查厂方详尽数据(如电容随电压/温度的变化曲线、额定纹波电流、热阻等)。若需更高温度稳定性或更小的偏置损失,可考虑改用 C0G/NP0(精密)或更大封装/不同介质的器件;若需更高能量缓冲或纹波承受能力,可与电解或钽电容并联使用。

如需进一步的电气参数曲线、焊接规范或 PCB 尺寸建议,可提供要求,我将基于 HRE 官方资料给出更详尽的指导。

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