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HRE CGA1210X5R476K160RT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA1210X5R476K160RT
- Type
- HRE
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA1210X5R476K160RT
- Electronic Component
- 1
- Electronic Component
- 47uF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.194g
- Electronic Component
- 1
- Electronic Component
- BM0264495032
- Electronic Component
- X5R
- Voltage
- 16V
- Electronic Component
- Electronic Component
- Electronic Component
- 500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA1210X5R476K160RT 产品概述
一、产品简介
CGA1210X5R476K160RT 为 HRE（芯声）系列贴片多层陶瓷电容（MLCC），额定容量 47 µF，公差 ±10%，额定电压 16 V，介质类型 X5R，封装 1210（公制 3216）。该型号针对一般电子设备中对中大容量、高密度封装的去耦、旁路与储能需求设计，兼顾体积与容值，是常见的电源滤波元件。
二、主要特性
- 电容值：47 µF ±10%（标称，室温测量）
- 额定电压：16 V DC，满足中低压电源总线应用
- 温度特性：X5R（-55°C 到 +85°C，温度范围内电容变化较小，适用于一般工业与消费类环境）
- 封装：1210，适合自动贴装与高密度 PCB 布局
- 性能：低阻抗、响应速度快，适合去耦与瞬态能量供应（注意：X5R 为高介电常数材料，受直流偏压影响，实际工作电压下有效电容会下降）
三、典型应用
- 开关电源输入/输出去耦与稳压电容
- MCU、模拟/电源模块的去耦与旁路
- 电源总线的储能与瞬态吸收
- 工业控制、通信设备、消费电子中需中大容量贴片电容的场景
四、选型与注意事项
- 直流偏压效应：X5R 材料在施加直流电压时会有显著的电容衰减，设计时应预留裕量，避免以额定电压作为长期工作点。
- 温度与寿命：高温环境或长期高电压下电容性能会衰减，关键应用建议做可靠性验证。
- 精度与配对：对电容精度和温漂有严格要求的电路，应考虑配合其他类型电容或采用更高规格介质。
五、封装与焊接建议
1210 封装适配自动贴片生产工艺，建议采用符合 JEDEC/Reflow 规范的焊接曲线，注意预热与回流档位以减少热应力，避免空焊与裂纹。存储时防潮包装（卷带）优先，贴装前回流板面处理须清洁。
六、质量与采购信息
HRE（芯声）提供商用级质量管控与可靠包装，常见包装为卷带（Tape & Reel），可按生产需求批量订购。订购时请核对完整料号 CGA1210X5R476K160RT 及批次参数，必要时索取样品与相关可靠性测试报告进行评估。
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