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HRE CGA0805X5R475K500MT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X5R475K500MT
- Type
- HRE
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X5R475K500MT
- Electronic Component
- 1
- Electronic Component
- 4.7uF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.039g
- Electronic Component
- 1
- Electronic Component
- BM0264495140
- Electronic Component
- X5R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 2000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X5R475K500MT 产品概述
一、产品简介
CGA0805X5R475K500MT（品牌：HRE/芯声）为贴片多层陶瓷电容（MLCC），额定电容值为 4.7µF，容差 ±10%，额定电压 50V，温度特性为 X5R，封装为 0805（约 2.0mm × 1.25mm）。该系列适用于需要中等容量与中高电压兼顾的电源去耦与滤波场合，兼顾体积与储能能力。
二、主要技术参数
- 容值：4.7µF（标称）
- 精度：±10%（K）
- 额定电压：50V DC
- 温度特性：X5R（-55°C ~ +85°C，容值变化通常在 ±15% 范围内）
- 封装：0805（2012 公制尺寸，≈2.0mm × 1.25mm）
- 结构：多层陶瓷（MLCC）
注：具体电气特性（如等效串联电阻 ESR、等效串联电感 ESL、耐压余量、纹波电流等）请参考厂家数据手册或测试报告。
三、产品特性与优点
- 体积小、容量相对较大：0805 封装下提供 4.7µF，适合空间受限的电路板设计。
- 稳定的温度特性：X5R 在常见工作温度范围内容值变化受控，适合一般工控及民用电子产品。
- 额定电压高达 50V：适配较高电压点的去耦与储能需求，如中低功率电源轨和开关电源输入/输出滤波。
- 可用于高密度贴装：适配常见 SMT 生产线与回流焊工艺，良好的批量可产性。
四、典型应用场景
- PCB 电源去耦、局部储能（DC-DC 转换器输出侧、线性稳压器输入输出）
- 滤波与旁路（模拟前端、电源滤波网）
- 工业控制、通信设备、消费电子以及汽车非关键子系统（需按实际车规级件确认）
五、安装与使用建议
- 回流焊工艺参考无铅焊接曲线（峰值温度按厂家手册建议，一般 ≤260°C 的短时峰值），避免过长高温暴露以降低裂纹风险。
- 焊盘设计与锡膏涂覆要均匀，避免由焊接应力导致的机械破裂。
- 在高应力应用（如陶瓷电容靠近机械固定点）应留意机械保护与应力缓冲。
- 若电路对温漂、漏电流或长期可靠性有严格要求，请进行样品验证并参考完整数据手册。
六、可靠性与品质保证
HRE（芯声）系列产品通常通过常规的电气与机械测试（耐压、绝缘、温度循环、振动和冲击等）。为确保长期稳定性，建议在关键应用中进行寿命测试与应力验证，并依照 IPC/J-STD 等相关规范进行 PCB 设计与加工控制。
七、采购与包装提示
- 型号编码：CGA0805X5R475K500MT（请以厂家/经销商订单确认件为准）
- 常见包装方式：卷带供料（适配自动贴装机）
- 订购时请注明批次与包装需求，并索取完整技术资料与试验报告以便验证。
如需更详细的电气参数曲线（频率响应、ESR/ESL 曲线、纹波电流额定）、回流焊曲线或样品测试服务，请提供具体应用条件，我可以协助整理并给出更精准的选型与布局建议。
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