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HRE CGA1210X5R226K350RT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA1210X5R226K350RT
- Type
- HRE
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA1210X5R226K350RT
- Electronic Component
- 1
- Electronic Component
- 22uF
- Package
- 1210
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.157g
- Electronic Component
- 1
- Electronic Component
- BM0264080253
- Electronic Component
- X5R
- Voltage
- 35V
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA1210X5R226K350RT 产品概述
一、产品简介
CGA1210X5R226K350RT 是 HRE（芯声）推出的一款贴片多层陶瓷电容（MLCC），标称容量 22µF，初始容差 ±10%，额定电压 35V，介质材料为 X5R，封装为 1210。该器件体积适中，能在较宽温度范围内保持稳定的电容性能，适用于对体积与容值有较高要求的电源去耦与滤波场合。
二、主要特性
- 容值：22µF，符号 226 表示 22×10^6 pF。
- 精度：±10%（K）。
- 额定电压：35V，适合中低压直流电源系统。
- 介质：X5R（温度范围常规为 −55℃ 至 +85℃，随温度变化电容变化受限于规范范围）。
- 封装：1210 表面贴装，适用于自动贴装与回流焊工艺。
- 稳定性：具有较低的等效串联电阻（ESR）和寄生电感（ESL），可提供良好的瞬态响应。
三、电气与热性能要点
- 温度特性：X5R 在工作温度范围内的电容变化受控，但并非像 C0G 那样线性，设计时需考虑温漂影响。
- 直流偏压效应：在高工作电压下（接近额定 35V），实际可用电容会因偏压效应而显著下降，建议参考厂家 DC-bias 曲线进行裕量设计。
- 频率特性：在高频去耦场合表现优良；若需低频大容量滤波，可并联多只以降低 ESR 与提升有效容量。
- 温度与功率：陶瓷电容自身无显著功率耗散，但周边热源会影响其长期可靠性。
四、典型应用
- 开关电源输入/输出去耦与储能。
- 模拟与数模混合板的去耦与旁路。
- 电机驱动、通信设备、工业控制与汽车电子（非汽规）中的滤波与旁路。
- 便携式设备与音频电源滤波（需考虑偏压对容值影响）。
五、布局与焊接建议
- 布局：尽量靠近电源引脚与晶体管/稳压器输入端放置，缩短回路面积以抑制噪声。
- 并联：为减少 ESR/ESL 或弥补偏压下的容量损失，可并联不同封装或容量的 MLCC。
- 回流工艺：遵循通用回流曲线，避免超温或长时间高温暴露；出厂通常推荐峰值温度不超过 260℃。
- 清洗与预处理：若长期储存，请按干燥包装和回流前烘烤建议处理，避免湿气引起焊接缺陷。
六、可靠性与储存
- 存储建议：本产品通常以卷带防潮包装出货，开封后如未立即回流需按厂家建议进行干燥。
- 可靠性：X5R MLCC 在正常工作条件下具有较高可靠性，但对机械应力（如弯板）敏感，贴装与回流过程中应控制应力集中。
- 质量追溯：建议在批量应用前索取样品并进行电气与热循环验证，以确保在目标应用中的长期稳定性。
总结：CGA1210X5R226K350RT 提供了在中等电压下较大电容值的表贴解决方案，适合需要密集去耦与中频滤波的电源设计。设计时重点关注 DC-bias 与温度特性，并采用合适的布局与焊接工艺以保证性能与可靠性。
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