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HRE CGA0603C0G330J500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603C0G330J500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603C0G330J500JT
- Electronic Component
- 1
- Electronic Component
- 33pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0264778633
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603C0G330J500JT 产品概述
一、产品简介
CGA0603C0G330J500JT 为 HRE(芯声) 推出的 0603 封装多层陶瓷电容器（MLCC），额定容值 33 pF，精度 ±5%，额定电压 50 V，介质材料为 C0G (又称 NP0)。此类产品以温度稳定性好、介质损耗低著称，适合对频率稳定性和时间精度有较高要求的电路。
二、主要技术参数
- 容值：33 pF
- 精度：±5%（J）
- 额定电压：50 V
- 温度系数 / 材料：C0G（温漂接近零）
- 封装：0603（1608 公制）
- 品牌：HRE（芯声）
三、核心特性与优势
- 温度稳定：C0G 介质在 -55℃ 至 +125℃ 范围内电容偏移极小，适合高精度应用。
- 低损耗、高 Q：在射频和高频场合表现优越，损耗因子低，品质因数高。
- 低偏压系数：在 DC 偏置下容值变化微小，适合计时、谐振与滤波电路。
- 抗老化性佳：相较于高介电常数材料，C0G 几乎不发生随时间的衰减。
四、典型应用场景
- 高频耦合/去耦、谐振回路、振荡器与滤波器
- 高频射频前端与匹配网络
- 精密模拟前端、定时电路与采样电路
- 精密测量与温度稳定要求高的电子设备
五、选型与使用建议
- 若工作在高频或需高 Q，优先选择 C0G 材料；若追求更大容量，可考虑 X7R/Y5V 等但要注意温漂与老化。
- 0603 尺寸适合大多数 SMD 应用，但应注意安装应力，避免贴片过程中过度弯曲 PCB 或强力抠取元件。
- 推荐遵循典型回流焊温度曲线，采用合适的焊盘尺寸与过孔布局以降低机械应力。
- 对关键频率电路可考虑对电压和温度做仿真和测量验证。
六、封装与可靠性
CGA0603C0G330J500JT 常见为卷带（Tape-and-Reel）包装，适配自动贴片机。C0G 陶瓷结构本身稳定，常见失效模式为机械裂纹或焊接应力导致的断裂，应在 PCB 设计和工艺中采取防护措施。
七、订购参考
产品编号中可识别基本信息：封装 0603、介质 C0G、容值 33pF、精度 J(±5%)、额定电压 500（表示 50V）。详尽包装、最小起订量及交期请联系 HRE（芯声）或授权分销商确认。
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