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HRE CGA0201C0G101J500ET
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0201C0G101J500ET
- Type
- HRE
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0201C0G101J500ET
- Electronic Component
- 1
- Electronic Component
- 100pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±5%
- Electronic Component
- 0.008g
- Electronic Component
- 50
- Electronic Component
- BM0247733672
- Electronic Component
- C0G
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0201C0G101J500ET 产品概述
一、产品简介
CGA0201C0G101J500ET 是 HRE（芯声）推出的一款超小型0201封装陶瓷贴片电容，标称容值 100 pF，容差 ±5%，额定电压 50V，温度系数为 C0G（又称 NP0）。该器件为无极性、无铅认证和无卤素设计，符合 IEC60384 系列标准，适用于一般电子设备及移动终端中的高密度电路需求。
二、电气与温度特性
C0G（NP0）介质属于一类温度稳定性优异的介质，电容随温度变化非常小，典型温度稳定可在 -55°C 至 +125°C 工作温度范围内保持高精度。该类型具有极低介质损耗和高 Q 值，适合对频率稳定性、低损耗和精密度有较高要求的场合。
三、封装与物理特性
0201（约 0.6 mm × 0.3 mm）为超小型表贴封装，适合高密度贴装与轻薄化产品。器件无极性，便于布线和安装。产品采用卷带（ET）包装，兼容自动贴装流程。由于体积微小，PCB 布局与贴装需注意焊接工艺与机械应力控制。
四、可靠性与合规
产品通过 IEC60384 系列测试，满足湿热、振动、焊接后可靠性等工业标准要求；并通过无铅认证与无卤素要求，适配 RoHS 类环保规范，便于用于消费类与移动设备平台的量产与环保合规性审查。
五、典型应用场景
适用于精密滤波、谐振与匹配网络、高频旁路/去耦、振荡器及定时电路等。100 pF/50V 的规格在射频前端、射频滤波、耦合电路以及移动设备天线调谐和频率稳定元件中应用广泛。
六、设计与装配建议
- 布局：对于去耦与滤波，尽量将电容靠近芯片电源引脚并缩短回流路径。
- 贴装：推荐使用高精度贴片机与细间距回流工艺，避免过度机械应力与弯折。
- 回流：遵循制造商推荐的回流曲线，并控制最高峰值温度与保温时间。
- 贮存：遵守厂方防潮等级与烘烤要求，开盘后如有潮湿风险请按 MSL 要求处理。
七、型号含义参考
型号可按命名规则读出：CGA0201（封装）C0G（介质）101（100 pF）J（±5%）500（50V）ET（卷带包装）。最终以厂方出具的规格书为准。
总结：CGA0201C0G101J500ET 以其温度稳定性高、损耗低和超小封装特点，适合对体积与性能有严格要求的现代电子与移动终端设计，是追求高频特性与精密度应用的理想选择。若需更详细的电性能曲线、回流规范或可靠性报告，可联系 HRE（芯声）获取完整规格书与样品测试支持。
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