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HRE CGA0805X7R104K500KT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0805X7R104K500KT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0805X7R104K500KT
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Electronic Component
- BM0264495108
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0805X7R104K500KT 产品概述
一、产品简介
CGA0805X7R104K500KT 为 HRE(芯声) 品牌的多层陶瓷贴片电容（MLCC），标称容量 100nF（0.1µF），公差 ±10%，额定电压 50V，介质材料等级 X7R，封装为 0805（约 2.0 × 1.25 mm，公制 2012）。该系列定位为通用旁路、滤波和耦合用途的中介电容，适用于消费类、通信设备和工业电子等常规电子产品的电路设计与表面贴装生产工艺。
二、主要特性
- 容值：100nF（0.1µF）
- 精度：±10%（在常温下标称值）
- 额定电压：50V DC
- 介质：X7R（工作温度范围典型为 -55°C ~ +125°C，随温度电容会发生变化）
- 封装：0805（适用于 SMT 自动贴装）
- 适用工艺：回流焊（遵循厂商回流温度曲线）
三、性能与使用注意
- 温度特性：X7R 为中等稳定性的高介电常数陶瓷，温度范围广但电容量随温度变化可能达数十个百分点（X7R 类器件在温度边界处常见电容偏移），因此在对电容量稳定性要求极高的场合应谨慎选型或选用 C0G/NP0。
- 直流偏压影响：在较高直流偏压下，实际有效电容会下降，尤其是体积小、介电常数高的 MLCC，应在目标工作点上进行仿真或测量确认。
- 耐焊接性：适合常规回流焊工艺，焊接温度应遵循供应商推荐的回流曲线，避免超过最大回流峰值温度。
四、典型应用场景
- 电源去耦与旁路（芯片电源、稳压器输入/输出）
- 高频滤波与噪声抑制
- 耦合/去耦电路
- 一般目的的旁路与旁支电容，用于消费电子、通信模组、工业控制板等
五、封装与采购建议
- 0805 尺寸适合自动贴装与手工调试并兼顾容量与可焊性。料号中“104”表示 100nF，“K”表示 ±10%，“500”可对应 50V 额定电压标识，具体编码规则请参照供应商规格书。
- 供应常见包装为卷带（Tape & Reel），便于 SMT 生产线使用。采购时建议索取并确认完整的技术规格书、回流曲线及可靠性测试报告。
六、可靠性与存储
- 存储时应避免受潮、高温及机械应力；长时间暴露在潮湿环境下可能影响焊接质量。
- 在关键或高可靠性应用中，建议与供应商确认温度循环、湿热、焊接热冲击等可靠性测试结果，以及是否有相关行业认证（如需）。
使用该型号时，应结合具体电路工作电压、温度范围和频率特性进行仿真验证，必要时与其他电容类型（如 C0G/NP0）配合使用，以满足系统的稳定性与精度要求。若需完整规格书或样品测试数据，请联系 HRE(芯声) 或授权分销渠道获取。
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