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HRE CGA0603X7R471K500JT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CGA0603X7R471K500JT
- Type
- HRE
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CGA0603X7R471K500JT
- Electronic Component
- 1
- Electronic Component
- 470pF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0265109128
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603X7R471K500JT 产品概述
一、产品简介
CGA0603X7R471K500JT 是 HRE（芯声）推出的一款贴片多层陶瓷电容（MLCC），标称电容值为 470 pF，初始容差 ±10%（K），额定电压 50 V，介质材料为 X7R，封装为 0603（1608 公制）。该型号定位为通用型中介电常数电容器，兼顾体积小、温稳性和成本效益，适合批量 SMT 贴装应用。
二、主要特性
- 容值：470 pF，适合滤波、耦合与阻容时间常数电路。
- 精度：±10%，可满足多数一般电路的容值匹配要求。
- 额定电压：50 V，适用于中低压模拟与数字电路。
- 介质：X7R，温度范围 -55 ℃ 至 +125 ℃，在该温区内电容变化通常在 ±15% 以内（典型 X7R 特性），兼顾温度稳定性与体积效率。
- 封装：0603，适用于高密度贴片 PCB 布局，良好焊接可靠性与可回流焊兼容性。
- 品牌：HRE（芯声），提供量产供货与物料追溯。
三、典型应用场景
- 电源去耦与旁路：消除高频噪声、稳定电源节点。
- 高频滤波与阻抗匹配：在射频前端或滤波网络中作为小值旁路/耦合电容使用。
- 时钟与时序电路：与电阻配合形成 RC 定时元件。
- 模拟信号链：用于滤波、旁路或旁路耦合，兼顾体积与性能。
四、封装与物料信息
- 尺寸：0603（约 1.6 mm × 0.8 mm），厚度随型号略有差异。
- 贴装：适配标准 0603 焊盘，推荐遵循厂商推荐的焊盘尺寸与锡膏印刷工艺以保证焊点可靠性。
- 兼容性：支持无铅回流工艺（需按回流曲线控制峰值温度与时长）。
五、设计与使用建议
- 温度与偏压影响：X7R 在高偏压及高温下会出现容值减少，设计时应考虑工作条件下的有效容值。
- 电压裕量：长寿命与高可靠性场合建议适度降低工作电压以减缓偏压引起的容值下降与老化。
- 焊接工艺：遵循制造商提供的回流曲线，避免重复高温循环以降低裂纹风险。
- 贴装注意：0603 小尺寸在振动或机械应力下易发生裂纹，布局时避免元件桥位或过近的机械应力集中。
六、质量与可靠性
HRE（芯声）对 MLCC 采用常规的电性能与环境应力测试（如温度循环、温湿度偏压、机械冲击等），提供稳定的批次质量与可追溯性。建议在关键项目中与供应方确认具体的检验报告与可靠性测试条款。
以上为 CGA0603X7R471K500JT 的产品概述。如需详细的电气特性曲线、封装尺寸图、回流焊工艺参数或可靠性测试报告，可进一步提供以便获取完整的数据手册。
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