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HRE CSA0201X7R103K500ET
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- HRE CSA0201X7R103K500ET
- Type
- HRE
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HRE
- Electronic Component
- CSA0201X7R103K500ET
- Electronic Component
- 1
- Electronic Component
- 10nF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.008g
- Electronic Component
- 50
- Electronic Component
- BM0264495026
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CSA0201X7R103K500ET 产品概述
一、产品简介
CSA0201X7R103K500ET（品牌：HRE/芯声）为超微型贴片多层陶瓷电容（MLCC），标称电容值10nF，容差±10%，额定电压50V，温度特性X7R，封装0201。面向高密度贴装、空间受限的消费类、通信和便携式电子产品的去耦与滤波需求。
二、主要参数
- 容值：10nF (103)
- 容差：±10%（K）
- 额定电压：50V DC
- 温度特性：X7R（-55°C ~ +125°C，典型电容随温度变化不超过±15%）
- 封装：0201（约0.6 mm × 0.3 mm，厚度约0.23–0.3 mm，实际以数据表为准）
- 封装形式：贴片（SMD/SMT）
三、核心特性与优势
- 极小封装：0201尺寸提供最高的 PCB 布局密度，适用于微型化设计。
- 容值稳定性：X7R 在宽温区间内保持较小的电容漂移，适合一般去耦和旁路用途。
- 中高电压能力：50V 额定满足多数模拟、功率及信号链电压要求。
- 批量一致性：HRE（芯声）通过工艺控制与出厂筛选，保证批次参数一致，适合自动贴装生产线。
四、典型应用
- 数字电路电源去耦与旁路（微控制器、电源管理芯片周边）
- 高频滤波与信号完整性改善（入/出滤波器）
- 移动终端、可穿戴设备、物联网模块等空间受限场景
- 模拟电路中作旁路或耦合用（注意 X7R 非 C0G/NPO，不适合高精度定容场合）
五、焊接与使用建议
- 推荐采用回流焊工艺，遵循厂家给出的温度曲线以避免裂纹与性能退化。
- 0201 封装对贴装精度与回流曲线敏感，建议使用高精度贴装机与适当的助焊膏。
- 在高压或脉冲应力场合注意电容的击穿与电容有效值下降，必要时选择更大尺寸或更高等级器件。
- 避免在安装过程中受机械应力与弯曲，应保证 PCB 支持与过孔布局合理。
六、可靠性与质量控制
HRE 标准出厂检验一般包括外观、尺寸、电容/损耗/漏电流测试及温度循环、湿热与冲击振动可靠性试验。针对 0201 小体积器件，注意应力裂纹（C-S crack）与焊接后长期老化特性。
七、订购信息与注意事项
完整型号：CSA0201X7R103K500ET；购买时确认封装、容量、容差、额定电压与温度系数一致。大批量采购建议索取批次试样与可靠性报告以验证性能满足具体应用需求。
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