WMSIC Electronic Components

HRE CGA0603COG101J500JT

ModelCGA0603COG101J500JT
Package0603
BrandHRE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
HRE CGA0603COG101J500JT
Type
HRE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HRE
Electronic Component
CGA0603COG101J500JT
Electronic Component
1
Electronic Component
100pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264495350
Electronic Component
C0G
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CGA0603COG101J500JT 多层陶瓷贴片电容(MLCC)产品概述

CGA0603COG101J500JT是芯声(HRE) 推出的一款工业级多层陶瓷贴片电容(MLCC),针对高密度电路设计优化,具备优异的温度稳定性与高频特性,广泛适配消费电子、通信、工业控制等领域的信号滤波、耦合及去耦需求。

一、产品基本属性

该型号为0603封装(英制代码,对应公制1608,即长1.6mm×宽0.8mm)的MLCC,核心参数明确:

  • 容值:100pF(标识“101”,其中“10”为有效数字,“1”表示×10¹);
  • 精度:±5%(标识“J”,属于常规精度档);
  • 额定电压:50V DC(满足低压电路的安全工作需求);
  • 温度系数:C0G(即NP0类,陶瓷电容中温度稳定性最优的类别);
  • 品牌:芯声(HRE),国内MLCC领域的成熟供应商,产品覆盖通用至工业级场景。

二、核心性能特点

1. 温度稳定性优异

C0G温度系数决定了其在**-55℃~+125℃** 宽温范围内,容值变化率≤±30ppm/℃,几乎不受温度变化影响,适合对容值稳定性要求高的电路(如射频、精密滤波)。

2. 高频损耗低

C0G材质的介质损耗角正切值(tanδ)极小(典型值≤0.0005@1kHz),在高频信号传输中不会引入额外损耗,适配100MHz以上的射频电路。

3. 封装紧凑适配高密度设计

0603封装体积小、重量轻,可显著降低PCB布局空间,适合智能手机、可穿戴设备等对尺寸敏感的产品,同时支持自动化SMT贴装,提升生产效率。

4. 可靠性高

采用多层陶瓷叠层工艺,端电极经镍/锡镀层处理,焊接兼容性好;产品通过高温寿命、温度循环等可靠性测试,满足工业级应用的长期稳定需求。

三、典型应用场景

该型号因性能均衡,覆盖多领域的常规电路需求:

  1. 消费电子:手机、平板、智能穿戴的信号滤波、耦合电路,如音频模块、射频前端;
  2. 通信设备:路由器、基站的射频链路滤波,以及电源去耦电路;
  3. 工业控制:PLC、传感器模块的信号调理电路,稳定滤波避免干扰;
  4. 小型医疗仪器:便携式监护仪的信号采集与处理电路,保障数据准确性;
  5. 汽车电子:非车载核心的低压辅助电路(如车内照明、传感器供电滤波),需注意实际工作电压需降额使用。

四、关键规格参数明细

项目 规格值 备注 封装类型 0603(1608公制) 长1.6±0.15mm,宽0.8±0.15mm,厚0.8±0.1mm 容值 100pF(101) 有效数字×10¹ 精度 ±5%(J档) 常规精度,满足多数应用需求 温度系数 C0G(NP0) 宽温下容值稳定 额定电压 50V DC 最大工作电压(降额后建议≤40V) 工作温度范围 -55℃~+125℃ 工业级温度范围 介质损耗(tanδ) ≤0.0005@1kHz 高频损耗低 包装方式 卷带包装(10k reels) 适配SMT自动化生产

五、品牌与品质保障

芯声(HRE)作为国内MLCC领域的专业厂商,产品具备以下优势:

  1. 环保合规:符合RoHS 2.0、REACH等国际环保标准,无铅无镉;
  2. 品质认证:生产流程通过ISO9001质量管理体系认证,部分型号满足AEC-Q200车规级标准(需确认具体批次);
  3. 供应链稳定:拥有自主生产线,产能充足,可满足批量订单需求;
  4. 技术支持:提供选型、焊接工艺等技术咨询,协助客户优化电路设计。

六、选型与使用注意事项

  1. 电压降额:实际工作电压建议不超过额定电压的80%(即≤40V),避免过压导致电容老化或失效;
  2. 温度系数匹配:若应用对容值变化不敏感(如电源滤波),可考虑X7R等低成本材质,但C0G更适合精密射频场景;
  3. PCB焊盘设计:0603封装的焊盘尺寸建议为长1.41.6mm、宽0.60.8mm,避免焊盘过大导致焊接时电容偏移;
  4. 焊接工艺:回流焊温度曲线需控制在220℃~245℃(峰值),避免过热导致陶瓷层开裂;
  5. 储存条件:未开封产品需储存在25℃±5℃、湿度≤60%的环境中,开封后建议1个月内使用完毕,防止端电极氧化。

CGA0603COG101J500JT凭借其稳定的性能、紧凑的封装及可靠的品质,成为通用低压电路中替代进口同规格产品的优质选择,可满足多数中高端电子设备的设计需求。

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