Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
CGA0603COG101J500JT是芯声(HRE) 推出的一款工业级多层陶瓷贴片电容(MLCC),针对高密度电路设计优化,具备优异的温度稳定性与高频特性,广泛适配消费电子、通信、工业控制等领域的信号滤波、耦合及去耦需求。
该型号为0603封装(英制代码,对应公制1608,即长1.6mm×宽0.8mm)的MLCC,核心参数明确:
C0G温度系数决定了其在**-55℃~+125℃** 宽温范围内,容值变化率≤±30ppm/℃,几乎不受温度变化影响,适合对容值稳定性要求高的电路(如射频、精密滤波)。
C0G材质的介质损耗角正切值(tanδ)极小(典型值≤0.0005@1kHz),在高频信号传输中不会引入额外损耗,适配100MHz以上的射频电路。
0603封装体积小、重量轻,可显著降低PCB布局空间,适合智能手机、可穿戴设备等对尺寸敏感的产品,同时支持自动化SMT贴装,提升生产效率。
采用多层陶瓷叠层工艺,端电极经镍/锡镀层处理,焊接兼容性好;产品通过高温寿命、温度循环等可靠性测试,满足工业级应用的长期稳定需求。
该型号因性能均衡,覆盖多领域的常规电路需求:
芯声(HRE)作为国内MLCC领域的专业厂商,产品具备以下优势:
CGA0603COG101J500JT凭借其稳定的性能、紧凑的封装及可靠的品质,成为通用低压电路中替代进口同规格产品的优质选择,可满足多数中高端电子设备的设计需求。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products