WMSIC Electronic Components

HCI 0122M4-25.000F12DWNL 0122M4

Model0122M4-25.000F12DWNL
PackageSMD2520-4P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 0122M4-25.000F12DWNL
Type
HCI
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
0122M4-25.000F12DWNL
Electronic Component
1
Package
SMD2520-4P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.145g
Frequency
25MHz
Electronic Component
1
Electronic Component
BM0264982144
Operating Temperature
40℃~+105℃
Electronic Component
±10ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0122M4-25.000F12DWNL 产品概述

一、产品简介

0122M4-25.000F12DWNL 为杭晶(HCI)出品的全国产化贴片晶振,频率为 25.000 MHz。器件采用 SMD2520-4P 小型金属封装,结构稳固、焊接可靠,旨在为各种电子系统提供稳定、精确的时钟参考。常温频差±10 ppm,频率稳定度(全温区)±20 ppm,等效串联电阻(ESR)80 Ω,负载电容标称 12 pF,工作温度范围 -40 ℃ ~ +105 ℃,适合工业级环境下使用。

二、主要参数

  • 品牌:HCI(杭晶)
  • 型号:0122M4-25.000F12DWNL
  • 类型:贴片晶振(晶体谐振器)
  • 频率:25.000 MHz
  • 常温频差(Initial):±10 ppm
  • 频率稳定度(-40~+105℃):±20 ppm
  • 负载电容:12 pF
  • 等效串联电阻(ESR):80 Ω
  • 工作温度:-40 ℃ ~ +105 ℃
  • 封装:SMD2520-4P(金属封装,4引脚)

三、产品特点与优势

  • 国产化供应,便于生产与长期替代;品质和供货链可控。
  • SMD2520 小尺寸金属封装,占板面积小,机械强度高,抗振性能好,适合自动贴装与回流焊工艺。
  • 宽温工作范围及良好频率稳定性,能满足工业控制、通信和测试设备等对时间基准的严格要求。
  • 标称 12 pF 负载电容,便于与主流 MCU/晶振电路配合使用;ESR 80 Ω,适配多数高增益晶体振荡器电路。

四、典型应用场景

  • 通信与网络设备(包括以太网PHY等需 25 MHz 时钟的场合)
  • 工业控制与自动化系统
  • 测试与测量仪器、数据采集模块
  • 消费电子及嵌入式系统的时钟源

五、使用与焊接建议

  • 为保证标称负载电容 12 pF 的实际效果,建议在晶体两端各并接等值电容;由于 PCB 和引脚寄生电容存在,常用电容取值在 18~22 pF 范围以实现实际 CL≈12 pF。
  • 电容应靠近 MCU/振荡器管脚放置,减少走线寄生和耦合噪声。
  • 参考器件推荐的振荡电路(如 CMOS/CMOS-inverter 型振荡器),注意不要超驱动晶体,保证启动与稳定工作。
  • 遵循一般回流焊工艺规范,避免过激的机械应力或弯折;焊接后建议进行必要的功能与频率验证。

六、可靠性与选型建议

  • 在系统选型阶段,请结合目标电路的驱动能力与启动需求评估 ESR 与负载电容匹配;若对相位噪声或长期频率漂移有更高要求,可咨询厂家或选用更高等级的频率源(如温补或恒温晶振)。
  • 对于需满足汽车功能安全或特定认证的项目,请与供应商确认器件是否具备相应资格与可靠性测试报告。
  • 如需样品、详细封装/焊盘尺寸图或应用电路,建议联系杭晶(HCI)技术支持获取完整资料与建议。

此款晶振以小体积、国产化供应与工业级温度范围为优势,适合对 25 MHz 时钟有稳定性与长期供货要求的各类电子产品。

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