Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
HCI 0132M425000F20DTNJL
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- HCI 0132M425000F20DTNJL
- Type
- HCI
- Minimum package
- 3000 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- HCI
- Electronic Component
- 0132M425000F20DTNJL
- Electronic Component
- 1
- Package
- SMD3225-4P
- Electronic Component
- Passive Crystal Oscillator
- Electronic Component
- 0.1g
- Frequency
- 25MHz
- Electronic Component
- 1
- Electronic Component
- BM0264527064
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- ±10ppm
- Crystal Oscillator Type
- SMDCrystal Oscillator
- Load Capacitor
- 20pF
- Frequency
- ±20ppm
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0132M425000F20DTNJL 产品概述
一、产品简介
0132M425000F20DTNJL 是杭晶（HCI）出品的一款全国产化贴片晶振，封装为 SMD3225-4P（金属盖式贴片封装，尺寸 3.2×2.5mm，4 Pad）。标称工作频率为 25.000 MHz，面向需要稳定时钟源的消费类、工业类与通信类电子产品，兼顾 SMT 贴装工艺和长期运行可靠性。
二、主要电气参数
- 频率：25 MHz
- 常温频差：±10 ppm（25℃ 标称点）
- 频率稳定度：±20 ppm（含温度变化与典型环境影响）
- 负载电容：20 pF
- 等效串联电阻（ESR）：60 Ω
- 工作温度范围：-40 ℃ ~ +85 ℃
三、产品特点与优势
- 全国产化：供应链本土化，便于批量交付和后续技术支持。
- 紧凑封装：3225 小尺寸，适配高密度 SMT 板级布局，降低 PCB 占用面积。
- 金属盖结构：增强机械强度与可靠性，对温度和振动有良好抑制作用。
- 宽温工作：-40℃~+85℃ 满足多数工业级和车规前端环境的常用温域需求。
- 高稳定性：常温初始偏差小，适用于对时钟精度有一定要求的系统设计。
四、典型应用场景
- 单片机、DSP、FPGA 的系统时钟与参考时钟。
- 通信模块、以太网 PHY、网络设备的参考振荡源。
- 消费电子、工业控制、数据采集和测试仪器等需要精确时钟的产品。
- 需要 SMT 贴片组装的自动化生产场景。
五、使用与安装建议
- SMT 焊接：兼容常规回流焊工艺；建议遵循元器件厂商提供的回流曲线及预热/峰值温度限制。
- 负载电容：按电路板设计匹配 20 pF 负载电容以获得标称频率与稳定性。
- 静电防护：在搬运和贴装过程中注意 ESD 防护，避免对晶振结构造成损伤。
- 存储与老化：建议避免长期高温高湿环境存放，必要时按厂方建议进行老化与筛选。
六、包装与采购建议
杭晶通常提供适用于 SMT 贴装的卷带（Tape & Reel）包装，满足自动化贴片生产需求。大批量采购可与厂商沟通交期与质量放行要求，获取样品做功能与温漂验证后再行量产投用。
本产品以稳定的频率性能、工业级温度特性和国产化供应链为优势，适合对成本、可靠性和可供给性均有要求的电子产品设计与生产应用。若需更详细的封装图、回流曲线或测试曲线，请向供应商索取完整技术资料。
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