WMSIC Electronic Components

HCI 3131M232768DTTLLLL

Model3131M232768DTTLLLL
PackageSMD3215-2P
BrandHCI
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
HCI 3131M232768DTTLLLL
Type
HCI
Minimum package
3000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
HCI
Electronic Component
3131M232768DTTLLLL
Electronic Component
1
Package
SMD3215-2P
Electronic Component
Passive Crystal Oscillator
Electronic Component
0.038g
Frequency
32.768kHz
Electronic Component
1
Electronic Component
BM0264527000
Operating Temperature
40℃~+85℃
Electronic Component
±20ppm
Crystal Oscillator Type
SMDCrystal Oscillator
Load Capacitor
12.5pF
Frequency
±20ppm
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3131M232768DTTLLLL 产品概述

一、产品简介

3131M232768DTTLLLL 为国产化贴片表晶,出自品牌 HCI(杭晶),封装形式为 SMD3215-2P(3.2×1.5mm,2 引脚)。该器件工作频率 32.768 kHz,专为实时时钟(RTC)、低功耗计时与计数系统设计,具有小体积、低功耗、易贴装的特点。型号已升级为 FC31M2-32.768-NTLLLDT,产品性能满足消费电子、物联网、智能表计等批量国产替代需求。

二、主要性能参数

  • 晶振类型:贴片晶振(表晶,2 引脚)
  • 标称频率:32.768 kHz
  • 常温频差:±20 ppm(室温出厂校准)
  • 频率稳定度:±20 ppm(典型温度范围内)
  • 负载电容:12.5 pF(CL)
  • 等效串联电阻(ESR):70 kΩ(典型)
  • 工作温度:-40 ℃ ~ +85 ℃
  • 封装:SMD3215-2P(封装尺寸 3.2×1.5 mm)
  • 制造:全国产化,适合 SMT 贴装流程

三、封装与机械特性

SMD3215-2P 小尺寸封装便于高密度 PCB 布局,适配常见表面贴装设备(SPI/回流焊工艺)。封装外观为两端金属引脚,须按厂商推荐的焊盘尺寸和回流曲线进行贴装与焊接,以保证焊接可靠性和振荡性能。

四、典型应用

  • 实时时钟(RTC)与时基源
  • 低功耗穿戴设备、手表与手环
  • 智能表计、远程抄表终端
  • IoT 传感终端、无线模块的时间基准
  • 工业控制等需长期稳定计时的场景

五、使用建议与电路注意事项

  • 外接负载电容:根据 CL=12.5 pF 的要求,外部两端电容 C1、C2 的选择应遵循公式 CL = (C1·C2)/(C1+C2) + Cstray。若 PCB 与输入引脚寄生电容(Cstray)约 2–5 pF,推荐 C1 = C2 ≈ 15–22 pF(常见起始值 18 pF),并通过实际测量微调以达到最佳稳频。
  • 与 MCU 配合:确认目标 MCU 的晶振驱动能力能驱动 ESR≈70 kΩ 的负载。多数 MCU 内部振荡器可兼容,但在边界条件下可能需调整放大器偏置或采用外部放大器。
  • 布局建议:晶振与 MCU 的相关引脚应尽量靠近布线,减少走线长度与回路面积,避免噪声耦合;GND 面连续,避免信号线穿越晶体附近。
  • 回流与焊接:遵循厂商回流曲线,避免过高温度或长时间热冲击,保证频率稳定性与长期可靠性。
  • 环境考量:工作温度 -40~+85 ℃,在极端温度或强振动环境下需评估频率漂移与老化特性。

六、型号与供应信息

此产品为 HCI(杭晶)系列的国产化产品线,型号升级为 FC31M2-32.768-NTLLLDT,市场编码 3131M232768DTTLLLL(用于内部订单与 BOM 标注时请核对供应商给出的最终型号与包装信息)。如需样品、批量供货或封装图纸、回流曲线与建议焊盘尺寸,请联系供应商获取详细资料与检测报告。

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