WMSIC Electronic Components

Walsin 0805B224K500CT

Model0805B224K500CT
Package0805
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
(Walsin) 0805B224K500CT
Type
WALSIN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0805B224K500CT
Electronic Component
1
Electronic Component
220nF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0264890187
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0805B224K500CT 产品概述

1. 产品简介

0805B224K500CT 是一款由华新科(Walsin)生产的表面贴装多层陶瓷电容器(MLCC),适用于广泛的电子应用。该电容器具有高可靠性和稳定性,能够在各种环境条件下提供优异的性能。

2. 主要参数

  • 电容值: 0.22µF
  • 容差: ±10%
  • 额定电压: 50V
  • 温度系数: X7R
  • 工作温度范围: -55°C ~ 125°C
  • 尺寸: 0.079" 长 x 0.049" 宽(2.00mm x 1.25mm)
  • 厚度(最大值): 0.053"(1.35mm)
  • 封装: 0805(2012 公制)

3. 应用领域

0805B224K500CT 适用于多种通用电子设备,包括但不限于:

  • 消费电子产品: 如智能手机、平板电脑、笔记本电脑等。
  • 工业控制设备: 如PLC、传感器、电机控制等。
  • 通信设备: 如路由器、交换机、基站等。
  • 汽车电子: 如车载娱乐系统、导航系统、发动机控制单元等。

4. 产品特点

  • 高可靠性: 采用优质陶瓷材料和先进制造工艺,确保产品在各种恶劣环境下稳定工作。
  • 宽温度范围: 工作温度范围为-55°C ~ 125°C,适应各种极端环境。
  • 低ESR和ESL: 低等效串联电阻(ESR)和等效串联电感(ESL),提供优异的电气性能。
  • 小型化设计: 0805封装尺寸小巧,适合高密度PCB布局,节省空间。
  • 环保合规: 符合RoHS指令,无铅无卤,环保安全。

5. 技术规格

  • 电容值: 0.22µF
  • 容差: ±10%
  • 额定电压: 50V
  • 温度系数: X7R
  • 工作温度范围: -55°C ~ 125°C
  • 尺寸: 0.079" 长 x 0.049" 宽(2.00mm x 1.25mm)
  • 厚度(最大值): 0.053"(1.35mm)
  • 封装: 0805(2012 公制)

6. 产品优势

  • 高稳定性: X7R温度系数确保电容值在宽温度范围内保持稳定。
  • 高耐压: 50V额定电压,适用于多种高压应用。
  • 长寿命: 优质材料和先进工艺确保产品具有长使用寿命。
  • 易于安装: 表面贴装设计,适合自动化生产线,提高生产效率。

7. 应用案例

  • 智能手机: 用于电源管理模块,提供稳定的滤波和储能功能。
  • 工业控制设备: 用于信号调理和滤波,提高系统稳定性和可靠性。
  • 通信设备: 用于射频模块,提供优异的电气性能。
  • 汽车电子: 用于发动机控制单元,确保系统在各种环境下的稳定运行。

8. 使用注意事项

  • 存储条件: 产品应存放在干燥、无尘的环境中,避免高温和高湿。
  • 焊接条件: 建议使用回流焊工艺,焊接温度和时间应符合产品规格要求。
  • 电气测试: 在使用前应进行电气测试,确保产品符合设计要求。

9. 结论

0805B224K500CT 是一款高性能、高可靠性的多层陶瓷电容器,适用于多种电子设备。其优异的电气性能、宽温度范围和小型化设计,使其成为工程师在设计高密度、高性能电子系统时的理想选择。华新科(Walsin)作为全球领先的电子元器件制造商,致力于为客户提供高质量的产品和优质的服务,0805B224K500CT 正是这一承诺的体现。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.