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0402B103K500CT是华新科(Walsin) 推出的一款多层陶瓷电容器(MLCC),采用0402(公制1005)表面贴装封装,属于X7R介质类型的中高压陶瓷电容,核心面向小型化、宽温稳定的电子电路设计需求,是消费电子、通信、工业等领域的通用型被动元器件。
该电容的关键技术参数明确,可直接匹配多数电路设计:
参数项 具体值 关键说明 标称容值 10nF(103pF) 10³×10pF=10nF,容值密度适中 容值精度 ±10%(K档) 满足一般电路匹配,无需额外校准 额定电压 50V(直流) 覆盖3.3V/5V/12V等中低压场景 温度系数 X7R -55℃~+125℃,容值变化≤±15% 封装尺寸 0402(英制)/1005(公制) 0.04″×0.02″/1.0mm×0.5mm 介质类型 多层陶瓷(MLCC) 小体积下实现高容值集成宽温稳定性突出
X7R介质的温度特性使其在-55℃至+125℃范围内,容值波动不超过±15%,能稳定工作于户外设备、车载电子(常规场景)、工业控制等宽温环境,避免温度变化导致的电路性能漂移。
小体积适配高密度设计
0402封装(1.0mm×0.5mm)是当前小型化电子设备的主流封装之一,可有效缩小电路板面积,适配智能手机、可穿戴设备、物联网模块等对空间要求严格的产品。
电压与精度匹配通用场景
50V额定电压覆盖了多数中低压电路(如电源滤波、射频信号耦合);±10%的精度满足一般电子系统的匹配需求,无需额外校准即可稳定工作。
低损耗与环保特性
X7R介质的损耗角正切值(tanδ)远低于Y5V等低容值介质,适合信号滤波、高频耦合等对损耗敏感的场景;产品符合RoHS无铅标准,满足全球环保法规要求。
该电容因体积小、温稳性好,广泛应用于以下领域:
封装工艺适配
0402封装采用表面贴装技术(SMT),焊盘尺寸与行业标准一致,可兼容主流回流焊、波峰焊工艺,生产良率稳定。
可靠性测试
华新科对该型号电容进行了严格测试:高低温循环(-55℃+125℃,1000次)、湿度测试(85℃/85%RH,1000小时)、振动测试(102000Hz,加速度2g),失效率符合行业高可靠标准。
环保与认证
产品通过RoHS 2.0、REACH等环保认证,部分批次可提供AEC-Q200(汽车级)认证(需确认采购批次),满足不同领域合规要求。
华新科(Walsin)是全球领先的被动元器件制造商,拥有30余年MLCC生产经验,产品覆盖多领域。0402B103K500CT采用成熟叠层工艺,批次一致性好,批量采购可提供技术支持与样品测试,降低客户研发风险。
该电容凭借小体积、宽温稳、通用适配的特点,成为电子设计中电源滤波、信号耦合的优选元件之一。
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