WMSIC Electronic Components

Walsin 0402B103K500CT

Model0402B103K500CT
Package0402
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
(Walsin) 0402B103K500CT
Type
WALSIN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0402B103K500CT
Electronic Component
1
Electronic Component
10nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0264353681
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0402B103K500CT 陶瓷电容器产品概述

一、产品基本定位

0402B103K500CT是华新科(Walsin) 推出的一款多层陶瓷电容器(MLCC),采用0402(公制1005)表面贴装封装,属于X7R介质类型的中高压陶瓷电容,核心面向小型化、宽温稳定的电子电路设计需求,是消费电子、通信、工业等领域的通用型被动元器件。

二、核心性能参数

该电容的关键技术参数明确,可直接匹配多数电路设计:

参数项 具体值 关键说明 标称容值 10nF(103pF) 10³×10pF=10nF,容值密度适中 容值精度 ±10%(K档) 满足一般电路匹配,无需额外校准 额定电压 50V(直流) 覆盖3.3V/5V/12V等中低压场景 温度系数 X7R -55℃~+125℃,容值变化≤±15% 封装尺寸 0402(英制)/1005(公制) 0.04″×0.02″/1.0mm×0.5mm 介质类型 多层陶瓷(MLCC) 小体积下实现高容值集成

三、关键特性与优势

  1. 宽温稳定性突出
    X7R介质的温度特性使其在-55℃至+125℃范围内,容值波动不超过±15%,能稳定工作于户外设备、车载电子(常规场景)、工业控制等宽温环境,避免温度变化导致的电路性能漂移。

  2. 小体积适配高密度设计
    0402封装(1.0mm×0.5mm)是当前小型化电子设备的主流封装之一,可有效缩小电路板面积,适配智能手机、可穿戴设备、物联网模块等对空间要求严格的产品。

  3. 电压与精度匹配通用场景
    50V额定电压覆盖了多数中低压电路(如电源滤波、射频信号耦合);±10%的精度满足一般电子系统的匹配需求,无需额外校准即可稳定工作。

  4. 低损耗与环保特性
    X7R介质的损耗角正切值(tanδ)远低于Y5V等低容值介质,适合信号滤波、高频耦合等对损耗敏感的场景;产品符合RoHS无铅标准,满足全球环保法规要求。

四、典型应用场景

该电容因体积小、温稳性好,广泛应用于以下领域:

  1. 消费电子:智能手机、平板电脑的电源去耦、音频信号耦合,笔记本电脑主板滤波电路。
  2. 通信设备:路由器、交换机的射频前端匹配,基站设备的电源滤波模块。
  3. 工业控制:PLC可编程控制器、传感器节点的电源稳压,电机驱动电路的噪声抑制。
  4. 物联网与可穿戴:智能家居网关、智能手表的传感器电路耦合,蓝牙模块的信号滤波。
  5. 汽车电子(通用级):车载导航、行车记录仪的电源滤波,适配-40℃~+85℃的常规车载环境。

五、封装与可靠性说明

  1. 封装工艺适配
    0402封装采用表面贴装技术(SMT),焊盘尺寸与行业标准一致,可兼容主流回流焊、波峰焊工艺,生产良率稳定。

  2. 可靠性测试
    华新科对该型号电容进行了严格测试:高低温循环(-55℃+125℃,1000次)、湿度测试(85℃/85%RH,1000小时)、振动测试(102000Hz,加速度2g),失效率符合行业高可靠标准。

  3. 环保与认证
    产品通过RoHS 2.0、REACH等环保认证,部分批次可提供AEC-Q200(汽车级)认证(需确认采购批次),满足不同领域合规要求。

六、品牌与品质保障

华新科(Walsin)是全球领先的被动元器件制造商,拥有30余年MLCC生产经验,产品覆盖多领域。0402B103K500CT采用成熟叠层工艺,批次一致性好,批量采购可提供技术支持与样品测试,降低客户研发风险。

该电容凭借小体积、宽温稳、通用适配的特点,成为电子设计中电源滤波、信号耦合的优选元件之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.