Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Walsin 0805B104K101CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- (Walsin) 0805B104K101CT
- Type
- WALSIN
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- (WALSIN)
- Electronic Component
- 0805B104K101CT
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0264353685
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805B104K101CT 产品概述
0805B104K101CT是Walsin Technology Corporation（华新科）生产的一款多层陶瓷电容器（MLCC），该产品凭借其优异的性能和可靠性，广泛应用于电子电路中，尤其是在需求高稳定性和长寿命的场合。
1. 基本参数
- 电容值：0.1 µF
- 额定电压：100V
- 容差：±10%
- 温度系数：X7R
- 工作温度范围：-55°C ~ 125°C
- 安装类型：表面贴装（SMD）
- 封装/外壳：0805（2012公制）
- 尺寸：2.00mm x 1.25mm（0.079" x 0.049"）
- 最大厚度：1.35mm（0.053"）
- 状态：在售
2. 设计与应用
0805B104K101CT采用表面贴装技术（SMT）设计，这使得其在现代电路板的安装过程中占据了重要位置。0805封装的电容器由于其相对较小的尺寸和高性能参数，已经成为手机、平板电脑、笔记本电脑以及各种消费电子产品和工业设备中不可或缺的元器件。
由于该电容器的额定电压为100V，能够适应较高电压环境，使其在需要电压较高的电子电路中展现出卓越的特性。而其0.1 µF的电容值也使其在滤波、去耦和旁路等应用方面表现优异。结合其±10%的容差，设计师能够确保产品在不同工作条件下的稳定性。
3. 材料特性
0805B104K101CT使用了X7R类型的陶瓷材料，该材料在温度范围-55°C到125°C内表现出良好的电气特性和低介电损耗。X7R电容器适合多种应用，具有较高的稳定性，不易受到温度变化的影响。这种特性使其非常适合于要求功率稳定、抗电压尖峰的电路。
4. 安装与使用注意事项
在设计电路时，0805B104K101CT为SMT设计，而工程师在焊接时应注意保持适当的焊接温度和时间，以避免热损伤。此外，考虑到Y5V与X7R电容的电气特性差异，设计师在电路设计时，选择适当的电容材料是提高电路性能的关键。
5. 总结
0805B104K101CT是一款具有广泛应用前景的高性能多层陶瓷电容器，凭借其稳定的电气性能、宽广的工作温度和高额定电压，成为了现代电子设备中不可或缺的基础组件之一。它不仅适用于滤波和去耦等基本应用，还能在更加复杂的电路设计中发挥重要作用，为各类电子产品提供稳定的电力供应和信号完整性。
随着消费电子产品对轻薄化和高性能的不断追求，该系列电容器无疑将在未来的电子产品设计中保持其领先地位，满足快速发展的市场需求。对设计师和工程师而言，0805B104K101CT不仅是一个简单的电容器，而是实现其创新设计和功能强大产品的重要基础。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
