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Walsin RF03N3R0B500CT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
17
specifications
Core information
- Product name
- (Walsin) RF03N3R0B500CT
- Type
- WALSIN
- Minimum package
- 15000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- (WALSIN)
- Electronic Component
- RF03N3R0B500CT
- Electronic Component
- 1
- Electronic Component
- 3pF
- Package
- 0201
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- 0.008g
- Electronic Component
- 1
- Electronic Component
- BM0264212680
- Electronic Component
- NP0
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 15000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
RF03N3R0B500CT 产品概述
一、产品简介
RF03N3R0B500CT 是华新科（Walsin）推出的一款片式多层陶瓷电容，标称容值 3 pF，额定电压 50 VDC，温度系数为 NP0（又称 C0G）。该器件采用 0201 小尺寸封装，公差 ±0.1 pF，专为要求高稳定性、低损耗和小体积的高频电路设计。
二、核心参数
- 容值：3 pF（±0.1 pF，约 ±3.3%）
- 额定电压：50 V DC
- 温度系数：NP0 / C0G（近零温漂，温度系数接近 0 ppm/°C）
- 封装：0201（典型外形约 0.6 mm × 0.3 mm）
- 极性：无极性（无方向性）
三、特性与优势
- 温度稳定性高：NP0 材料在宽温区间内电容值几乎不随温度变化，适合精密时序和频率敏感电路。
- 低损耗、高 Q：材料损耗角正切极低，ESR 与损耗小，利于维持滤波器与谐振回路的高品质因数。
- 小尺寸适合高密度组装：0201 封装可节省 PCB 面积，适用于手机、无线模块与便携设备。
- 容值公差紧：±0.1 pF 的精度满足对容值精确度有较高要求的匹配与校准场景。
四、典型应用
- 射频匹配网络、滤波器与调谐回路（手机前端、射频收发器）
- 振荡器和相位噪声敏感电路（时钟源、PLL）
- 精密模拟测量与传感器前端（需稳定电容行为的电路）
- 高频耦合与去耦场合（在特定频段作为补偿元件）
五、封装与焊接建议
- 支持常见回流焊工艺，建议按 JEDEC/IPC 推荐回流曲线控制峰值温度与升温速率。
- 0201 小尺寸器件需注意贴装精度与印刷锡膏量，避免偏置或桥连。
- 建议在布局时尽量缩短与关键节点的走线，减小寄生电感与阻抗。
六、可靠性与注意事项
- MLCC 为陶瓷类器件，受机械应力影响较大，贴装后避免过度弯曲板材以防开裂。
- 长期工作在高湿或极端温度环境时，应按厂家资料评估寿命与潮湿敏感性等级（MSL）。
- 设计时需考虑寄生电感/电阻对高频性能的影响，必要时在仿真中加入等效模型验证。
七、结论
RF03N3R0B500CT 以其 NP0 的温度稳定性、低损耗特性和 0201 超小体积，适合对频率稳定性与体积有严格要求的射频与精密电路。选型时应结合 PCB 布局、回流工艺与机械应力控制，确保长期可靠性与电性能稳定。若需进一步的等效电路参数或回流/贴装工艺规范，可参考华新科产品规格书。
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