WMSIC Electronic Components

Walsin 0402X105K100CT

Model0402X105K100CT
Package0402
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
(Walsin) 0402X105K100CT
Type
WALSIN
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0402X105K100CT
Electronic Component
1
Electronic Component
1uF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0264396882
Electronic Component
X5R
Voltage
10V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科0402X105K100CT陶瓷电容产品概述

一、产品基本身份与核心参数

华新科0402X105K100CT是一款多层陶瓷贴片电容(MLCC),品牌为华新科(Walsin),封装规格为0402(公制1005)。其核心电气参数清晰对应型号标识:

  • 容值:1μF(型号中“105”代表10×10⁵pF=1μF);
  • 精度:±10%(型号中“K”为精度代码);
  • 额定电压:10V(型号中“100”为电压代码);
  • 温度系数:X5R(陶瓷材质类别)。

该电容属于通用型MLCC,兼顾小型化与性能稳定性,是小型电子设备中高频应用的被动元件。

二、封装规格与物理特性

0402封装是贴片电容的典型小型化封装,英制尺寸为0.04英寸(长)×0.02英寸(宽),转换为公制后为1.0mm×0.5mm,厚度约0.5mm(批次略有差异)。采用无引脚贴片结构,焊盘直接与PCB焊接,适配高密度电路板设计,可有效节省空间。电容重量约0.01g,对设备整体重量影响极小,适合对体积、重量有严格要求的便携类产品。

三、关键电气性能指标

除核心参数外,该电容的关键电气性能包括:

  1. 损耗角正切(DF):1kHz测试频率下≤5%,能量损耗低,适合滤波、去耦等电路;
  2. 漏电流:25℃环境下,施加10V额定电压时≤10μA,满足一般电子设备绝缘要求;
  3. 等效串联电阻(ESR):100kHz测试频率下≤2Ω,低ESR特性提升高频电路信号完整性,减少信号衰减。

四、温度特性与稳定性

X5R材质的温度特性定义为:工作温度范围-55℃~+85℃,容值变化±15%。相比Y5V材质(容值变化±20%+85%),X5R的容值稳定性显著提升,可适应温度波动较大的场景(如户外物联网节点、汽车电子周边电路)。在-40℃+85℃的常用温度区间内,容值变化通常控制在±10%以内,保证电路性能一致性。

五、典型应用场景

该电容的小体积、稳定性能使其适用于多种小型化设备:

  1. 消费电子:智能手机射频前端、蓝牙/WiFi模块的电源去耦与信号滤波;
  2. 可穿戴设备:智能手表、手环的传感器供电电路、低功耗模块去耦;
  3. 物联网(IoT):户外传感器节点、智能家居设备的电源滤波与信号耦合;
  4. 便携式医疗设备:血糖仪、血氧仪的电源管理电路(满足小型化与可靠性要求);
  5. 汽车电子周边:车载USB充电器、车内传感器辅助电路(若需汽车级需确认AEC-Q200认证)。

六、品牌与可靠性优势

华新科作为全球知名被动元件厂商,该产品具备以下优势:

  1. 环保合规:符合RoHS 6、REACH法规,无铅、无镉等有害物质,满足全球市场准入;
  2. 焊接可靠性:适配标准回流焊工艺(峰值温度260℃±5℃,持续10~30秒),焊接后无虚焊、脱落风险;
  3. 可靠性测试:通过高温老化(125℃,1000小时)、高温高湿(85℃/85%RH,1000小时)测试,性能衰减率≤5%,适合量产应用。

该电容凭借小体积、稳定性能与可靠品质,成为小型电子设备中电源滤波、去耦的常用选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.