WMSIC Electronic Components

Walsin 1206B104K500CT

Model1206B104K500CT
Package1206
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
(Walsin) 1206B104K500CT
Type
WALSIN
Unit
Electronic Component
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
1206B104K500CT
Electronic Component
1
Electronic Component
100nF
Package
1206
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.044g
Electronic Component
1
Electronic Component
BM0264353684
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科1206B104K500CT多层陶瓷电容产品概述

华新科(Walsin)作为全球被动元器件领域的核心供应商,其1206B104K500CT是一款通用型多层陶瓷电容(MLCC),针对中低频电路的滤波、耦合、旁路等基础需求设计,兼具成本优势与性能稳定性,广泛覆盖消费电子、工业控制等多场景应用。

一、产品基本定位与型号解析

1206B104K500CT属于华新科常规MLCC产品线,型号编码清晰对应核心参数:

  • 1206:英制封装尺寸(3.2mm×1.6mm公制对应);
  • B:介质材料与封装厚度标识(对应X7R介质、常规厚度);
  • 104:容值代码(10×10⁴pF=100nF);
  • K:容值精度(±10%);
  • 500:额定电压(50V DC);
  • CT:电极与包装标识(镍锡电极、卷带包装)。

该产品主打中低端通用场景,平衡了容值稳定性、成本与封装密度,是电子设计中最常用的电容型号之一。

二、核心性能参数深度解析

1. 容值与精度

容值为100nF(10⁻⁷F),精度±10%(K级),满足大多数通用电路对容值偏差的容忍度(如电源滤波、音频耦合无需极高精度)。若需更高精度(±5%),可选择同系列J级产品(如1206B104J500CT)。

2. 额定电压与功率

额定电压50V DC,指长期工作时可承受的最大直流电压。实际应用中需注意:交流纹波电压叠加后的峰值电压不得超过50V,否则可能导致电容击穿或性能下降。该电压等级覆盖了多数低压电路(如5V/12V/24V系统的辅助电源)。

3. 温度系数与稳定性

采用X7R介质,温度特性符合EIA标准:

  • 工作温度范围:-55℃~+125℃;
  • 容值变化率:在-55℃~+125℃内≤±15%。

相比Y5V(温度系数-30%~+80%)等低稳定度介质,X7R的容值随温度变化更平缓,适合环境温度波动较大的场景(如汽车仪表、工业传感器)。

4. 介电损耗与频率特性

X7R介质的介电损耗(tanδ)在1kHz下典型值≤5%,适合中低频(DC~10MHz)应用;高频下(>100MHz)损耗会显著增加,此时需改用NPO介质电容,但本产品不适用超高频场景。

三、封装与物理特性

1. 封装规格

  • 英制:1206(长120mil×宽60mil);
  • 公制:3216(3.2mm×1.6mm);
  • 厚度:典型值1.0mm(±0.2mm,具体以官方datasheet为准)。

该封装是表面贴装(SMD)的通用尺寸,兼容绝大多数贴片机,焊接工艺成熟(回流焊、波峰焊均适用)。

2. 电极与焊接

电极采用镍锡(Ni/Sn)镀层,无铅环保(符合RoHS 2.0标准),焊接可靠性高:

  • 回流焊温度:峰值260℃(符合无铅焊接要求);
  • 波峰焊温度:峰值250℃(适合插件转贴装的混合工艺)。

3. 包装方式

通常采用卷带包装(Tape & Reel),每盘数量2000/3000/5000个不等,适合自动化生产。

四、典型应用场景

1206B104K500CT因成本低、性能稳定,广泛应用于以下场景:

  1. 电源电路滤波:
    • 直流电源输出端的低频纹波抑制(如5V/12V电源的电解电容并联去耦);
    • 数字芯片的电源引脚旁路(降低电源噪声对芯片的干扰)。
  2. 信号耦合/旁路:
    • 音频电路的信号耦合(如手机听筒与功放之间的耦合);
    • 射频电路的低频旁路(如蓝牙模块的辅助电路)。
  3. 小型电子设备:
    • 消费电子:手机、平板、智能穿戴的辅助电路;
    • 工业控制:传感器接口、PLC的小功率电源;
    • 汽车电子:车内辅助照明、仪表盘的低电压电路(非高压安全关键区)。

五、可靠性与注意事项

1. 可靠性指标

  • 工作寿命:在额定电压(50V DC)、工作温度(25℃)下,典型寿命≥10⁶小时;
  • 耐湿性:符合IEC 60068-2-67(温湿度循环测试),防潮性好;
  • 机械强度:符合EIA-198标准,可承受贴装过程中的机械应力,但需避免过度弯曲(如PCB板弯曲超过1mm会导致电容开裂)。

2. 应用注意事项

  • 避免过压:峰值电压不得超过50V,否则可能击穿;
  • 温度限制:工作温度不得超过125℃,否则容值会显著下降;
  • 机械应力:不得在电容上施加集中应力(如点胶过厚),否则会导致陶瓷介质开裂;
  • 焊接工艺:无铅焊接需控制温度曲线,避免过热导致电极脱落。

六、替代选型参考

若需替换1206B104K500CT,可优先选择同参数、同封装的产品:

  • 村田:GRM188R61C104KA37D(1206、100nF、50V、X7R、±10%);
  • 三星:CL21B104KAFNNNE(1206、100nF、50V、X7R、±10%);
  • TDK:C1206X7R104K50AT(1206、100nF、50V、X7R、±10%)。

若需调整参数:

  • 更高精度(±5%):选J级产品(如华新科1206B104J500CT);
  • 更高电压(100V):选额定电压100V的同封装产品(如华新科1206B104K100CT),但容值密度略低;
  • 更高温度稳定性:选NPO介质(如华新科1206N104J500CT),但容值精度更高、成本略高。

综上,华新科1206B104K500CT是一款高性价比的通用MLCC,适合大多数中低频电子电路的滤波、耦合需求,是电子设计中不可或缺的基础元器件之一。

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