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Walsin MT15B332K500CT
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- (Walsin) MT15B332K500CT
- Type
- WALSIN
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- (WALSIN)
- Electronic Component
- MT15B332K500CT
- Electronic Component
- 1
- Electronic Component
- 3.3nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 10
- Electronic Component
- BM0263512018
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MT15B332K500CT 产品概述
一、产品简介
MT15B332K500CT 为华新科（Walsin）制造的一款多层陶瓷电容器（MLCC），额定容值 3.3nF（3300pF），精度 ±10%，额定电压 50V，介质等级 X7R，封装为 0402（1005 公制）。该器件在体积极小的前提下提供稳定的电容特性，适合对体积和性能有较高要求的贴片应用。
二、电气与物理参数
- 容值：3.3nF（3300pF）
- 精度：±10%
- 额定电压：50V DC
- 介质：X7R（温度范围 -55°C ~ +125°C，典型温度偏差在规定范围内）
- 封装：0402（1.0 mm × 0.5 mm，1005 公制）
以上参数适用于常规工作条件，实际电容值会随温度和直流偏置（DC bias）产生变化，应在设计中予以考虑。
三、主要特点与优势
- 小尺寸高密度：0402 封装有利于板级空间优化，适配紧凑型电子产品。
- 稳定性良好：X7R 介质在宽温区间内保持较小容值漂移，适用于一般旁路、耦合和去耦场合。
- 工艺兼容：适用于无铅回流焊工艺；推荐按照制造商提供的回流曲线进行焊接以保证可靠性。
- 成本与可靠性平衡：在中等性能要求的消费与工业电子中，提供较好的成本效益比。
四、典型应用场景
- 电源去耦与滤波（微控制器、PMIC 附近）
- 高频耦合/旁路（射频前端非关键路径）
- 移动设备、穿戴设备、物联网终端与工业控制中的空间受限电路
在对噪声抑制和瞬态响应要求较高的场合，可与其他电容（如陶瓷大容量或钽电容）组合使用以取得更佳性能。
五、设计与布局建议
- 紧邻电源引脚布局以降低回路电感与阻抗；走线最短最粗。
- 注意直流偏置影响：高电压下 X7R 型号会有一定容值下降，关键电路建议进行实际偏置测试并留有裕量。
- 避免靠近 PCB 边缘或机械应力集中区域，焊盘设计要均匀以减少热机械应力导致的破裂风险。
- 焊接时遵循厂商回流温度曲线，必要时进行返修及残余应力控制。
六、可靠性与测试
MT15B332K500CT 适合在工业与消费类环境长期使用。常见可靠性检测包括耐压测试、温湿循环、热冲击和焊接后可靠性评估。对关键应用建议参照供应商提供的可靠性数据与失效概率分析，必要时做样片验证。
如需详细的电气参数曲线（频率特性、温度依赖、直流偏置曲线）、回流曲线或封装绘图，可联系供应商获取完整数据手册与可靠性报告。
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