Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Walsin 1206B472K102CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- (Walsin) 1206B472K102CT
- Type
- WALSIN
- Unit
- Electronic Component
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- (WALSIN)
- Electronic Component
- 1206B472K102CT
- Electronic Component
- 1
- Electronic Component
- 4.7nF
- Package
- 1206
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.044g
- Electronic Component
- 1
- Electronic Component
- BM0264353466
- Electronic Component
- X7R
- Voltage
- 1kV
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
1206B472K102CT多层陶瓷电容器（MLCC）产品概述
一、产品基本属性
1206B472K102CT是华新科（Walsin） 推出的一款高压贴片多层陶瓷电容器（MLCC），采用叠层陶瓷介质结构（多层陶瓷片与内电极交替叠合烧结），兼具高容值、高压耐受力与贴片封装的便利性，适配工业、电源等领域的高密度电路设计。
二、核心电气性能参数
该型号关键电气参数严格遵循工业标准，核心指标如下：
- 容值规格：4.7nF（即4700pF，型号中“472”为3位有效数标识：47×10²=4700pF）；
- 精度等级：±10%（型号中“K”为精度代码），满足大多数工业电路对容值偏差的要求；
- 额定电压：1000V DC（型号中“102”为电压代码：10×10²=1000V），可稳定承受直流1000V以下工作电压；
- 温度系数：X7R（EIA标准），工作温度范围为-55℃~+125℃，容值变化率≤±15%，宽温环境下保持相对稳定；
- 损耗角正切：典型值≤1%（1kHz/25℃），低损耗特性减少电路能量损耗，提升效率。
三、封装与尺寸规格
产品采用1206封装（公制对应3216，即长度3.2mm、宽度1.6mm），符合国际贴片元件标准，具体参数：
- 长度：3.2mm±0.2mm；
- 宽度：1.6mm±0.2mm；
- 典型厚度：1.0mm（适配常规贴片贴装设备，无需特殊治具）；
- 电极端：无铅锡基合金（符合RoHS环保要求），兼容回流焊、波峰焊等工艺。
四、温度特性与稳定性
X7R温度系数是该产品核心优势：
- 温度范围覆盖工业全场景（-55℃低温到+125℃高温），无需额外温度补偿；
- 容值变化率≤±15%，对比NPO（0温度系数）容值小的特点，X7R平衡了宽温稳定与高容值，降低成本；
- 长期工作容值漂移控制在IEC 60384-1标准范围内，可靠性优于普通陶瓷电容。
五、典型应用场景
基于高压、高容、宽温稳定特性，主要应用于：
- 高压电源滤波：开关电源、逆变器、UPS的高压直流侧滤波，抑制电压纹波；
- 高压信号耦合：医疗设备（高压理疗仪）、工业控制（高压传感器）的信号耦合路径；
- 模块旁路电容：高压功率模块（IGBT模块）的旁路设计，抑制高频噪声；
- 脉冲储能电路：小容量高压储能需求（激光驱动、点火电路），快速充放电响应。
六、品牌与可靠性优势
华新科作为全球知名MLCC厂商，该产品具备：
- 认证资质：通过ISO 9001、IATF 16949汽车级认证（部分批次），满足工业与汽车领域严苛要求；
- 可靠性测试：经过125℃/1000h高温寿命、-55℃~+125℃温度冲击、湿度循环测试，失效率符合工业级标准；
- 环保合规：无铅、无镉，符合RoHS 2.0、REACH指令，适配全球市场需求。
该产品以高性价比、稳定性能，成为工业高压电路设计的常用选型之一。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
