WMSIC Electronic Components

Walsin WR08W2004FTL

ModelWR08W2004FTL
Package0805
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
(Walsin) WR08W2004FTL
Type
WALSIN
Minimum package
5000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
WR08W2004FTL
Electronic Component
1
Package
0805
Electronic Component
SMD Resistor
Electronic Component
±1%
Electronic Component
0.034g
Electronic Component
2MΩ
Electronic Component
1
Electronic Component
BM0265429566
Operating Temperature
55℃~+155℃
Operating Voltage
150V
Electronic Component
±100ppm/℃
Resistor Type
Resistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科WR08W2004FTL厚膜固定电阻器产品概述

一、产品定位与核心特征

华新科(Walsin)WR08W2004FTL是一款针对中功率、高精度、宽温稳定需求设计的0805封装厚膜固定电阻器。作为华新科厚膜电阻系列的主流型号,该产品兼顾了小体积贴装便利性与性能可靠性,广泛适配工业控制、消费电子及汽车电子等领域的电路设计需求。核心特征可概括为:0805小封装下的125mW功率余量、±1%高精度阻值、宽温区(-55℃~155℃)稳定表现,以及150V额定工作电压的适配性。

二、关键参数详细解析

该型号的参数设计精准匹配多数中端电路的实际需求,核心参数及意义如下:

  1. 阻值与精度:标称阻值2MΩ(由4位代码“2004”标识,前三位有效数200、倍率10⁴,即200×10⁴Ω=2MΩ),精度±1%——高于常规5%/10%精度电阻,可满足信号分压、传感器校准等对阻值精准度要求较高的场景。
  2. 功率与电压:额定功率125mW(比0805封装常规100mW功率提升25%),额定工作电压150V;实际使用需同时满足功率约束:最大允许电压V=√(P×R)=√(0.125W×2e6Ω)=500V,但150V为推荐工作电压,可避免长期高压下的性能衰减。
  3. 温度系数(TCR):±100ppm/℃——即每变化1℃,阻值变化0.01%;在工作温区最大温差(155℃-(-55℃)=210℃)下,最大温漂为2.1%,结合±1%精度,总误差可控制在合理范围,适配宽温环境应用。
  4. 工作温区:-55℃~+155℃——符合工业级及汽车级(部分场景)的宽温要求,可稳定工作于极端温度环境。

三、封装与可靠性设计

  1. 封装规格:0805英制表面贴装封装(尺寸2.0mm×1.25mm),适配常规自动化贴装设备,适合高密度电路板设计。
  2. 工艺与可靠性:采用厚膜丝网印刷烧结工艺,电阻膜层附着力强、稳定性高;经华新科可靠性测试(如高温高湿、温度循环、耐脉冲冲击等),符合IEC 61041等国际标准,可长期可靠工作于复杂环境。

四、典型应用场景

该型号因参数适配性强,广泛应用于以下场景:

  1. 工业控制:PLC模拟量输入模块的分压网络(需精准阻值匹配信号采集)、电机驱动电路的电流检测电阻(宽温稳定避免误差);
  2. 消费电子:音频设备的信号衰减电路(低噪声厚膜工艺适配音频信号)、电源适配器的过压保护检测电阻(150V电压满足检测需求);
  3. 汽车电子:车载传感器接口电路(宽温-55℃~125℃适配车载环境)、车身控制模块的辅助分压电路。

五、选型与使用注意事项

  1. 功率降额:高温环境下需降额使用——125℃以上时,功率建议不超过额定值的50%(即62.5mW),避免热过载;
  2. 焊接规范:采用回流焊时,峰值温度控制在245±5℃,时间不超过10秒;手工焊温度不超过350℃,避免热冲击损坏电阻膜层;
  3. 存储要求:未焊接电阻存储于湿度<60%、温度25±5℃的环境,开封后建议1个月内使用完毕,避免受潮影响焊接性能;
  4. 电压约束:实际工作电压不得超过500V(由P=V²/R推导),避免击穿损坏。

该型号凭借平衡的性能与成本表现,成为中小功率电路设计中高精度、宽温应用的优选之一。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.