WMSIC Electronic Components

Walsin 0402X474K250CT

Model0402X474K250CT
Package0402
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
(Walsin) 0402X474K250CT
Type
WALSIN
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0402X474K250CT
Electronic Component
1
Electronic Component
470nF
Package
0402
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0265729363
Electronic Component
X5R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
10000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科0402X474K250CT多层陶瓷电容器产品概述

一、产品核心身份与定位

华新科(Walsin)0402X474K250CT是一款表面贴装多层陶瓷电容器(MLCC),属于通用型中容值、中低压陶瓷电容,专为小型化电子设备设计。其核心定位是平衡「容值密度、电压耐受、温度稳定性」与「封装体积」,满足消费电子、物联网等领域对紧凑空间内可靠滤波/耦合的需求,是中低端到中端电子设备的高性价比选择。

二、关键参数详解

该产品参数符合工业级标准,核心参数及含义清晰:

  • 容值:470nF(或0.47μF),采用「474」代码标识(前两位为有效数字47,第三位为10⁴倍,单位pF→47×10⁴=470000pF=470nF);
  • 精度:±10%,由代码「K」表示,属于工业级通用精度,可满足电源滤波、信号耦合等非精密电路需求;
  • 额定电压:25V(直流电压上限),交流峰值电压不超过35V(约1.4×额定直流电压),适配手机电池、IoT节点等低压电源系统;
  • 温度系数:X5R(EIA标准),温度范围为**-55℃~+85℃**,容值变化控制在±15%以内——相比Y5V(±20%或更高)稳定性更强,比NP0(±0.05%)成本更低,是性能与成本的平衡选择。

三、封装与物理特性

该产品采用0402表面贴装封装(公制对应1005),是当前小型化电子设备的主流封装之一:

  • 尺寸规格:英制0402(0.04英寸×0.02英寸)→ 公制1.0mm×0.5mm,典型厚度为0.5mm(±0.1mm);
  • 贴装兼容性:符合IPC-J-STD-001标准,支持自动化贴装(回流焊、波峰焊),生产效率高,适合批量制造;
  • 空间优势:相比0603封装(1.6mm×0.8mm),体积缩小约60%,可在相同PCB面积内集成更多电容,提升电路性能。

四、材料与温度特性

  • 介质材料:采用X5R型钛酸钡基陶瓷介质,通过添加改性剂优化容值温度稳定性,避免了Y5V材料在高温下容值大幅下降的问题;
  • 温度性能:在-55℃(极端低温)至+85℃(高温环境)范围内,容值偏差稳定在±15%以内,可适应户外智能穿戴(如智能手表)、工业传感器节点等温度变化场景;
  • 可靠性:多层陶瓷结构(通常10~20层)提升容值密度,电极与介质层结合紧密,抗机械应力(振动、跌落)能力强,长期使用容值下降率<1%/1000小时。

五、典型应用场景

该产品因「小体积+稳定性能」,广泛应用于以下领域:

  1. 消费电子:智能手机/平板的主板滤波(电池输入EMI滤波)、CPU/内存去耦电容、音频信号耦合;
  2. 物联网设备:小型IoT传感器节点(温湿度、运动传感器)的电源去耦,确保信号传输稳定;
  3. 工业控制:小型PLC模块、远程传感器的低压电路滤波,适应工业环境的温度波动;
  4. 车载附件:车载USB充电口、小屏幕显示器的电源滤波(普通附件场景适用)。

六、产品优势与市场价值

  1. 高容值密度:0402封装实现470nF/25V,是同封装下的高容值选择,满足小型化设备「大容值+小体积」需求;
  2. 成本效益平衡:X5R介质比NP0成本降低30%以上,比Y5V稳定性提升20%,适合中低端到中端设备批量应用;
  3. 环保合规:符合欧盟RoHS指令(无铅、无镉),满足全球电子市场环保要求;
  4. 品牌可靠性:华新科作为全球MLCC主要供应商,产品一致性好,供货稳定,适合长期批量采购。

该产品是华新科针对小型化电子趋势推出的核心通用MLCC,已在多个消费电子品牌终端产品中批量应用,是平衡性能、体积与成本的优选方案。

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