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WR06X201JTL是华新科(Walsin)WR系列下的一款0603封装厚膜片式电阻,专为小功率、高密度电子电路设计。型号字符含义明确:
该产品采用陶瓷基片厚膜工艺制造,兼具成本优势与性能稳定性,是通用电子电路的高性价比选择。
阻值为200Ω,精度±5%,满足大多数民用、工业通用电路的阻值匹配需求,无需额外高精度筛选,可直接批量应用。
额定功率100mW(0.1W),最大工作电压75V,可支撑小功率信号处理、分压电路等场景的电压负载,避免过压损坏风险。
温度系数为±100ppm/℃,表示每变化1℃,阻值相对变化百万分之一百(即0.01%/℃)。在全工作温度范围内(-55℃~+155℃),最大阻值漂移量为210℃×100ppm=2.1%,仍处于±5%精度范围内,保证宽温环境下性能稳定。
覆盖-55℃至+155℃,远超常规民用电子(0℃~70℃)的温度需求,可适应工业现场的低温、高温环境,或汽车电子的极端温度场景。
采用0603英制封装,体积小巧(约1.6mm×0.8mm×0.4mm),适合高密度PCB布局(如智能手机、智能手表等便携设备),可显著减少电路占用空间。
厚膜工艺通过丝网印刷电阻浆料于氧化铝陶瓷基片,经高温烧结形成稳定电阻层,兼具抗机械应力、耐温变的特点,长期使用不易出现阻值漂移。
因体积小、参数稳定,广泛应用于以下场景:
华新科(Walsin)作为全球知名被动元件制造商,产品符合IEC 60115、JIS C 5201等国际标准,生产过程严格遵循ISO 9001质量管理体系。WR06X201JTL通过温度循环、湿度测试、耐电压测试等可靠性验证,可提供稳定的长期性能,适合对成本与可靠性均有要求的电子设计。
该产品平衡了性能、成本与可靠性,是通用电子电路的实用选择。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
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The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
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When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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