Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
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WR08X2201FTL是华新科(Walsin)推出的通用型表面贴装厚膜电阻器,采用0805(公制2012)封装,针对电子电路阻抗匹配、分压、限流等基础功能设计,兼具成本效益与宽温可靠性,适用于消费电子、工业控制、汽车电子等多领域场景。
该型号命名遵循华新科厚膜电阻系列规则:WR为厚膜电阻系列代码,08X对应0805英制封装,2201为阻值编码(220×10¹=2.2kΩ),FTL为精度、封装及包装后缀(F代表±1%精度,T为表面贴装,L为卷带包装)。产品定位为商业级+工业级过渡型,既满足消费电子的成本需求,又具备工业级宽温适应性。
标称阻值为2.2kΩ,精度公差±1%,属于商业级较高精度范围——相比±5%普通电阻,可有效降低电路信号失真、采样误差,适用于电压采样、分压网络等对阻值一致性要求较高的场景。
额定功率125mW(1/8W),是0805封装典型功率等级;额定工作电压150V(直流/交流有效值)。实际应用建议功率降额至额定值50%以内(≤62.5mW),可显著延长产品寿命。
温度系数(TCR)为**±100ppm/℃(每℃阻值变化0.01%);工作温度范围覆盖-55℃~+155℃**,符合工业级环境要求(如户外设备、高温车间),宽温下阻值稳定性优于普通碳膜电阻。
采用0805英制封装(公制2012),尺寸2.0mm×1.2mm×0.5mm,焊盘兼容常规PCB贴装(推荐焊盘1.0mm×1.2mm),适合高密度电路布局,提升PCB空间利用率。
通过丝网印刷+高温烧结在氧化铝陶瓷基板形成电阻膜,相比薄膜电阻成本降低30%,相比碳膜电阻阻值稳定性提升40%以上;陶瓷基板低热膨胀系数抑制宽温漂移,散热性能良好。
该产品是电子电路基础电阻的优选方案,覆盖多数中低功率、宽温场景,兼具性能与成本优势。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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