WMSIC Electronic Components

Walsin 0603N120J500CT

Model0603N120J500CT
Package0603
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
(Walsin) 0603N120J500CT
Type
WALSIN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0603N120J500CT
Electronic Component
1
Electronic Component
12pF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±5%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265085250
Electronic Component
NP0
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

0603N120J500CT 陶瓷电容器产品概述

0603N120J500CT是华新科(Walsin)推出的一款Class 1型陶瓷电容器,采用NP0(C0G)温度稳定材质,封装为0603(公制1608),核心参数覆盖12pF容值、±5%精度、50V额定电压,适用于对容值稳定性要求较高的高频、射频及高精度电路场景。

一、产品基本参数与型号解读

该产品的核心参数可通过型号及官方规格明确,关键信息如下:

  • 容值:12pF(型号中“120”为容值编码——前两位“12”为有效数字,第三位“0”为倍率10⁰,单位pF);
  • 精度:±5%(型号中“J”为精度代码,对应行业标准±5%误差范围);
  • 额定电压:50V(型号中“500”为电压编码——50×10⁰=50V,直流额定电压);
  • 温度系数:NP0(C0G),属于Class 1陶瓷电容,温度稳定性远优于Class 2材质;
  • 封装:0603(英制)/1608(公制),尺寸为长1.6mm×宽0.8mm(公制标注);
  • 品牌:华新科(Walsin),全球被动元件领域核心供应商之一。

二、核心技术特性——NP0材质的稳定性优势

NP0(C0G)是Class 1陶瓷电容的典型材质,其核心优势体现在三大维度:

  1. 温度稳定性:温度系数≤±30ppm/℃(行业标准),即温度每变化1℃,容值变化不超过0.0003%,远优于X7R等Class 2材质(温度系数约±1500ppm/℃);
  2. 高频性能优异:高频损耗极低(DF值通常≤0.0001),适合1GHz以上射频电路,不会因频率升高导致容值下降或信号损耗增大;
  3. 容值抗干扰性:容值不受直流偏置电压、交流信号幅度影响,长期工作可靠性高,尤其适合振荡、匹配等对容值精度敏感的电路。

三、封装规格与贴装兼容性

0603(1608公制)是当前电子设备中应用最广泛的小型化封装之一,华新科该产品的物理参数及贴装特性如下:

  • 尺寸:长1.60±0.15mm,宽0.80±0.15mm,厚度0.50±0.05mm;
  • 端电极:宽度0.3±0.1mm,长度0.4±0.1mm,采用镍/锡镀层,兼容无铅(RoHS)焊接工艺;
  • 贴装兼容性:支持SMT自动化贴装,贴装精度要求≤±0.1mm,适合智能手机、穿戴设备等高密度PCB设计。

四、典型应用场景

基于NP0材质的稳定性及0603封装的小型化优势,该产品主要应用于以下领域:

  1. 射频(RF)通信:蓝牙、WiFi、5G基站等设备的射频前端匹配网络、带通滤波电路;
  2. 振荡与时钟电路:晶体振荡器(XO)、压控振荡器(VCO)的谐振回路,确保时钟频率稳定;
  3. 高精度模拟电路:ADC/DAC的参考电压滤波、信号调理电路,避免容值变化导致信号失真;
  4. 消费电子:智能手机、平板电脑、智能手表等的射频模块、无线充电辅助电路;
  5. 工业控制:PLC、传感器模块的高频滤波电路,适应宽温度范围(-55℃~125℃)。

五、品牌品质与可靠性保障

华新科作为全球被动元件领域的核心供应商,该产品通过多项行业认证,可靠性经严格测试:

  • 认证标准:ISO9001质量管理体系、ISO/TS16949汽车电子标准(部分批次)、RoHS无铅认证;
  • 可靠性测试:
    • 高温存储:125℃/1000h,容值变化≤±0.5%,DF≤0.0002;
    • 温度循环:-55℃~125℃,循环1000次,无开路/短路,容值变化≤±0.3%;
    • 湿度负载:85℃/85%RH/500h,容值变化≤±0.4%;
  • 应用覆盖:已广泛应用于华为、小米、三星等消费电子厂商,及中兴、爱立信等通信设备厂商。

六、选型与使用注意事项

为确保产品性能及可靠性,使用时需注意以下要点:

  1. 电压降额:实际工作直流电压应不超过额定电压的80%(即40V),避免过压导致陶瓷介质击穿;
  2. 温度范围:工作温度需控制在-55℃~125℃范围内,超出此范围可能影响容值稳定性;
  3. 焊接工艺:无铅焊接温度需控制在230℃~260℃(回流焊),焊接时间≤30s,避免高温损坏电极;
  4. 存储条件:未开封产品存储于温度25±5℃、湿度40%~60%的环境,开封后建议1个月内使用,避免受潮。

该产品凭借稳定的性能、小型化封装及可靠的品质,成为高频电路设计中的主流选型之一。

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