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Walsin 0402B221K500CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- (Walsin) 0402B221K500CT
- Type
- WALSIN
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- (WALSIN)
- Electronic Component
- 0402B221K500CT
- Electronic Component
- 1
- Electronic Component
- 220pF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 10
- Electronic Component
- BM0264549880
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0402B221K500CT 多层陶瓷电容器产品概述
一、产品基本参数与命名解析
0402B221K500CT是华新科（Walsin）推出的小型贴片多层陶瓷电容器（MLCC），核心参数明确：
- 容值：220pF（标识“221”，前两位为有效数字、第三位为10的幂次，即22×10¹=220pF）；
- 精度：±10%（标识“K”，行业通用精度代码）；
- 额定电压：50V（标识“500”，省略“V”后缀）；
- 温度系数：X7R（陶瓷介质类型，对应温度范围-55℃~+125℃，容值变化≤±15%）；
- 封装：0402（英制尺寸，对应公制1005）。
命名逻辑贴合行业标准，便于快速识别关键性能。
二、封装与物理尺寸
该产品采用表面贴装（SMD）封装，具体物理尺寸（公制）：
- 长度：1.0±0.2mm；
- 宽度：0.5±0.2mm；
- 厚度：0.5±0.1mm（典型值，依介质层数略有差异）。
电极材料为银钯合金（Ag-Pd），兼容无铅焊接工艺，适合高密度电路集成。
三、核心性能特性
- 宽温稳定性：X7R介质使容值在-55℃~+125℃范围内变化≤±15%，满足工业及消费电子的温度波动需求；
- 电压适应性：50V额定电压覆盖中等功率场景，实际应用建议工作电压不超过40V（预留20%安全裕量）；
- 高频低损：0402小封装带来低寄生参数（1kHz下ESR<50mΩ、ESL<1nH），适合射频电路去耦/耦合；
- 精度与损耗：±10%精度满足一般电路设计，1kHz下损耗角正切值（tanδ）<1%，能量损耗低。
四、典型应用场景
因封装紧凑、性能均衡，该产品广泛用于：
- 消费电子：智能手机、平板的射频前端（信号耦合）、电源模块（纹波滤波）；
- 工业控制：小型传感器节点、PLC模块的电源去耦、信号滤波；
- 通信设备：基站射频单元的小型滤波器、数字信号处理电路的去耦；
- 便携设备：智能穿戴、蓝牙耳机等紧凑产品的电路集成。
五、品牌与可靠性保障
华新科作为全球MLCC主流制造商，该产品具备：
- 环保合规：通过RoHS 2.0、REACH认证，无铅无有害物质；
- 质量管控：经高温老化、湿度循环等可靠性测试，失效率低；
- 供货稳定：成熟产能布局，可满足批量生产需求。
六、选型与使用注意事项
- 电压裕量：避免工作电压超过额定电压的80%，防止介质击穿；
- 温度适配：若环境温度>125℃，需更换X8R等更高温系数产品；
- 精度升级：需±5%精度则选“J”标识同系列，±1%选“F”标识；
- 焊接工艺：无铅回流焊峰值温度≤260℃，焊接时间≤10秒。
该产品以高性价比、稳定性能成为中小功率电路的常用选型，适配多数紧凑设计需求。
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