WMSIC Electronic Components

Walsin 0603X105K250CT

Model0603X105K250CT
Package0603
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
(Walsin) 0603X105K250CT
Type
WALSIN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0603X105K250CT
Electronic Component
1
Electronic Component
1uF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265275153
Electronic Component
X5R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科0603X105K250CT陶瓷电容器产品概述

华新科(Walsin)0603X105K250CT是一款针对高密度电子设计优化的多层陶瓷电容器(MLCC),核心参数匹配常规电子电路的滤波、耦合等需求,具备体积小、稳定性好的特点,广泛应用于消费电子、小型工业设备等领域。

一、产品核心参数与标识解析

该产品型号可拆解为关键参数信息,便于快速选型:

  • 封装标识:0603(英制封装代码,对应公制1608);
  • 容值与精度:X105K → X代表温度系数X5R,105表示容值为10×10⁵pF=1μF,K代表精度±10%;
  • 额定电压:250 → 额定直流电压(DC)25V;
  • 系列后缀:CT为华新科该系列的特定标识,对应标准封装与性能规格。

核心参数表:

参数项 具体规格 容值 1μF(105pF×10⁴) 精度 ±10%(K级) 额定电压 25V DC 温度系数 X5R(-55℃~+85℃) 封装 0603(英制)/1608(公制) 品牌 华新科(Walsin)

二、封装与尺寸规格

0603封装是电子行业通用的小型化封装,尺寸紧凑,适合高密度PCB布局:

  • 英制尺寸:长0.06英寸(1.524mm)×宽0.03英寸(0.762mm);
  • 公制尺寸:1.6mm×0.8mm(含引脚,典型值);
  • 厚度:0.8±0.1mm(华新科标准封装厚度);
  • 引脚间距:约0.5mm(适合常规SMT贴装设备)。

该封装可兼容多数主流SMT生产线,贴装效率高,尤其适合手机、智能穿戴等对空间要求苛刻的产品。

三、温度特性与稳定性

X5R温度系数是该产品的核心优势之一,定义为:

  • 工作温度范围:-55℃至+85℃;
  • 容值变化率:在额定温度范围内,容值变化不超过±15%(远优于Y5V的±82%)。

相比X7R(-55℃+125℃),X5R在常规应用温区(如消费电子常见的-40℃+85℃)的稳定性更优,且成本更具竞争力;适合需要稳定容值的滤波、耦合电路,避免因温度变化导致电路性能波动。

四、典型应用场景

该产品因体积小、参数匹配,广泛应用于以下领域:

  1. 消费电子:手机、平板、智能手表的CPU供电去耦、信号耦合(如射频前端、音频电路);
  2. 小型家电:遥控器、智能插座、蓝牙耳机的电源滤波、按键电路耦合;
  3. 工业控制:小型传感器模块(如温湿度传感器)的信号去噪、低压电源滤波;
  4. 汽车电子:低压辅助电路(如车内氛围灯、中控面板按键)的滤波(需确认工作温区符合-55℃~+85℃)。

例如,手机主板中,该电容可用于CPU核心供电的高频去耦,减少电压波动,提升系统稳定性。

五、选型与使用注意事项

  1. 电压降额:实际工作电压需低于额定电压的80%(即≤20V DC),避免长期过压导致电容老化或击穿;
  2. 温度限制:避免在环境温度超过+85℃的场景使用,否则容值变化超差可能影响电路性能;
  3. 焊接规范:回流焊峰值温度控制在240℃~250℃,单次焊接时间不超过10秒;波峰焊需避免长时间浸泡,防止封装变形;
  4. 储存条件:常温干燥环境(温度≤30℃,湿度≤60%)储存,储存期不超过12个月,开封后尽快使用;
  5. 极性问题:陶瓷电容器无极性,可正反贴装,但需注意贴装方向与PCB焊盘匹配,避免虚焊。

该产品平衡了体积、性能与成本,是常规电子设计中1μF/25V级电容的高性价比选型,适合批量应用于中低端消费电子及小型工业设备。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.