Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
华新科(Walsin)0603X105K250CT是一款针对高密度电子设计优化的多层陶瓷电容器(MLCC),核心参数匹配常规电子电路的滤波、耦合等需求,具备体积小、稳定性好的特点,广泛应用于消费电子、小型工业设备等领域。
该产品型号可拆解为关键参数信息,便于快速选型:
核心参数表:
参数项 具体规格 容值 1μF(105pF×10⁴) 精度 ±10%(K级) 额定电压 25V DC 温度系数 X5R(-55℃~+85℃) 封装 0603(英制)/1608(公制) 品牌 华新科(Walsin)0603封装是电子行业通用的小型化封装,尺寸紧凑,适合高密度PCB布局:
该封装可兼容多数主流SMT生产线,贴装效率高,尤其适合手机、智能穿戴等对空间要求苛刻的产品。
X5R温度系数是该产品的核心优势之一,定义为:
相比X7R(-55℃+125℃),X5R在常规应用温区(如消费电子常见的-40℃+85℃)的稳定性更优,且成本更具竞争力;适合需要稳定容值的滤波、耦合电路,避免因温度变化导致电路性能波动。
该产品因体积小、参数匹配,广泛应用于以下领域:
例如,手机主板中,该电容可用于CPU核心供电的高频去耦,减少电压波动,提升系统稳定性。
该产品平衡了体积、性能与成本,是常规电子设计中1μF/25V级电容的高性价比选型,适合批量应用于中低端消费电子及小型工业设备。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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