Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Walsin 0603B222K101CT
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
18
specifications
Core information
- Product name
- (Walsin) 0603B222K101CT
- Type
- WALSIN
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- (WALSIN)
- Electronic Component
- 0603B222K101CT
- Electronic Component
- 1
- Electronic Component
- 2.2nF
- Package
- 0603
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.035g
- Electronic Component
- 1
- Electronic Component
- BM0265085186
- Electronic Component
- X7R
- Voltage
- 100V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：0603B222K101CT 陶瓷电容器
一、基本信息
0603B222K101CT 是一款由华新科（Walsin）制造的表面贴装多层陶瓷电容器（MLCC），以其稳定的电性能和广泛的应用领域而闻名。该电容器具备以下主要参数：
- 电压：额定100V
- 电容值：2200pF
- 容差：±10%
- 温度范围：-55°C 至 125°C
- 厚度（最大值）：0.034"（0.87mm）
- 封装尺寸：0603（公制：1.60mm x 0.80mm）
- 温度系数：X7R
- 安装类型：表面贴装
二、产品特性
高电压能力： 该电容器的额定电压为100V，适用于需要较高电压保护的电路设计，从而能够满足大多数电子设备的标准电压要求。
适中的电容值： 2200pF 的电容值使其在信号耦合、去耦与滤波等应用中表现出色。该电容值在很多RF（射频）、音频和时钟电路等应用中均有良好的性能表现。
良好的温度特性： 采用X7R温度系数，可以在较宽的温度范围内保持相对稳定的电容值。这有助于确保在环境变化（温度变化）下，电路的正常运行。
小型封装： 0603的封装尺寸非常适合于空间受限的电子产品，如便携式设备、消费电子和紧凑型电路板布局，有助于设备的小型化和轻量化。
优良的可靠性： 华新科作为知名元件制造商，在生产过程中采用严格的质量控制措施，保证了产品的可靠性和长期稳定性。
三、应用场景
0603B222K101CT陶瓷电容器因其卓越的性能被广泛使用在各种电子产品中，主要应用场景包括但不限于：
消费电子： 适合用于智能手机、平板电脑、笔记本电脑等设备中的去耦和滤波电路，保障设备在复杂信号传输环境下的稳定操作。
工业设备： 在工业控制模块和仪器中，该电容器能够提供稳定的信号耦合和电源滤波，确保数据传输的可靠性。
汽车电子： 随着智能汽车的发展，该元件在汽车控制单元、安全系统及信息娱乐系统中的应用越来越广泛，其耐高温的特性非常符合汽车的使用环境。
通信设备： 在各种通信设备中，通过良好的频率特性和小型化设计，可以实现更高效的信号传输和处理。
四、总结
0603B222K101CT陶瓷电容器是一款性能全面、应用广泛的电子元器件，其特有的高电压能力、适中电容值、可靠性及小型化设计使其成为现代电子设备不可或缺的重要组成部分。这款电容器可广泛应用于多个领域，尤其在对尺寸和电性能有严格要求的场合，展现出其独特的价值。选择华新科的0603B222K101CT，不仅保障了产品的性能和质量，也为设计师提供了更多的设计灵活性和创新空间。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
