WMSIC Electronic Components

Walsin 0805X106K250CT

Model0805X106K250CT
Package0805
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
(Walsin) 0805X106K250CT
Type
WALSIN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0805X106K250CT
Electronic Component
1
Electronic Component
10uF
Package
0805
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.034g
Electronic Component
1
Electronic Component
BM0264353471
Electronic Component
X5R
Voltage
25V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科0805X106K250CT陶瓷电容产品概述

一、产品核心身份与定位

0805X106K250CT是华新科(Walsin) 推出的通用型多层陶瓷贴片电容(MLCC),聚焦中低功率电路的滤波、耦合与去耦需求。该产品以0805标准封装为载体,整合稳定容值、合理电压等级与紧凑尺寸,是替代电解电容的高性价比方案,广泛适配消费电子、工业控制等领域。

二、基础参数详解

核心电性能参数可明确拆解为以下关键指标:

  1. 容值与精度:标称容值10μF(编码“106”即10×10⁶ pF),精度±10%(标识“K”代表该等级),满足多数电路对容值偏差的基本要求;
  2. 额定电压:直流额定电压25V(标识“250”即25V),交流场景需按70%降额使用(峰值≤17.5V);
  3. 温度特性:采用X5R温度系数,工作温度范围-55℃~+85℃,此区间内容值变化率≤±15%,温度稳定性优于Y5V等低成本材质;
  4. 结构类型:无极性多层陶瓷结构,可正反贴装,安装灵活性高。

三、封装与物理特性

  1. 封装规格:国际标准0805贴片封装(英制:0.08″×0.05″;公制:2.0mm×1.25mm),典型厚度0.8mm,适配常规SMT生产线(回流焊、波峰焊兼容);
  2. 机械性能:陶瓷基体抗机械应力能力较强,但需避免过度弯折/冲击,防止电极脱落或电容开裂;
  3. 焊盘要求:两端金属电极需匹配0805标准焊盘(宽度0.60.8mm,长度1.21.5mm),确保焊接可靠性。

四、性能特点与优势

  1. 高容值密度:0805小封装实现10μF容值,体积较同容值电解电容缩小约70%,大幅降低电路布局空间;
  2. 长寿命无极性:无电解液干涸问题,寿命远长于铝电解电容,且无需考虑极性安装,减少装配错误;
  3. 高频特性优异:寄生电感/电阻极低,10MHz~100MHz频段容值/阻抗稳定,适配高频滤波、耦合电路;
  4. 成本效益突出:华新科主流供应商定位,性价比高于日系同类产品,适合批量应用的成本控制。

五、典型应用场景

因参数匹配性强,覆盖以下常见领域:

  1. 消费电子:智能手机、平板的电源滤波(Vcore/Vbus)、音频耦合;
  2. 工业控制:PLC、传感器模块的信号滤波、电源去耦;
  3. 汽车电子:车载中控、仪表的低压滤波(部分批次具备AEC-Q200认证);
  4. 通信设备:路由器、交换机的高频滤波、电源模块去耦;
  5. 小型家电:智能插座、加湿器的控制电路滤波。

六、选型与使用注意事项

  1. 温度适配:若环境温度超+85℃(如高温工业),需切换X7R(-55℃~+125℃)材质;
  2. 焊接工艺:回流焊峰值温度控制在230℃~250℃,时间≤10秒,避免过温开裂;
  3. 存储条件:未开封产品存于-10℃~+40℃、湿度≤60%环境,开封后12个月内用完(防止电极氧化);
  4. 认证确认:汽车/工业场景需核实AEC-Q200、RoHS/REACH等认证是否符合需求。

该产品以平衡的性能与成本,成为中低功率电路陶瓷电容选型的主流选项之一。

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