WMSIC Electronic Components

Walsin 0603B153K500CT

Model0603B153K500CT
Package0603
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
(Walsin) 0603B153K500CT
Type
WALSIN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0603B153K500CT
Electronic Component
1
Electronic Component
15nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265429557
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:0603B153K500CT

1. 产品简介

0603B153K500CT 是一款由华新科(Walsin)生产的表面贴装多层陶瓷电容器(MLCC),适用于广泛的电子电路应用。该电容器具有优异的电气性能和可靠性,广泛应用于消费电子、通信设备、工业控制等领域。

2. 关键参数

  • 电容值: 0.015µF(15nF)
  • 容差: ±10%
  • 额定电压: 50V
  • 温度系数: X7R
  • 工作温度范围: -55°C ~ 125°C
  • 尺寸: 0.063" 长 x 0.031" 宽(1.60mm x 0.80mm)
  • 厚度(最大值): 0.034"(0.87mm)
  • 封装: 0603(1608 公制)

3. 技术特点

  • 高可靠性: 采用优质陶瓷材料和先进制造工艺,确保产品在恶劣环境下仍能稳定工作。
  • 宽温度范围: X7R温度系数保证了在-55°C至125°C的宽温度范围内电容值的稳定性。
  • 小尺寸: 0603封装尺寸(1.60mm x 0.80mm)适合高密度电路板设计,节省空间。
  • 表面贴装: 适合自动化贴装工艺,提高生产效率。

4. 应用领域

  • 消费电子: 如智能手机、平板电脑、数码相机等。
  • 通信设备: 如基站、路由器、交换机等。
  • 工业控制: 如PLC、传感器、电机控制等。
  • 汽车电子: 如车载娱乐系统、导航系统等。

5. 品牌与质量

华新科(Walsin)作为全球领先的被动元件制造商,以其高质量和可靠性著称。0603B153K500CT 严格遵循国际质量标准,确保每一颗电容器都能满足客户的高要求。

6. 封装与尺寸

  • 封装类型: 0603(1608 公制)
  • 尺寸: 1.60mm x 0.80mm x 0.87mm

7. 电气性能

  • 电容值: 0.015µF
  • 容差: ±10%
  • 额定电压: 50V
  • 温度系数: X7R

8. 环境适应性

  • 工作温度: -55°C ~ 125°C
  • 存储温度: -55°C ~ 125°C
  • 湿度: 符合J-STD-020标准

9. 可靠性测试

  • 寿命测试: 1000小时,85°C,85%RH,额定电压
  • 温度循环: -55°C ~ 125°C,1000次循环
  • 机械冲击: 1500G,0.5ms,3次

10. 订购信息

  • 型号: 0603B153K500CT
  • 品牌: 华新科(Walsin)
  • 包装: 卷带包装,3000pcs/卷

11. 结论

0603B153K500CT 是一款高性能、高可靠性的多层陶瓷电容器,适用于各种电子设备。其小尺寸、宽温度范围和优异的电气性能使其成为工程师设计电路时的理想选择。华新科的品牌保证和严格的质量控制确保了产品的长期稳定性和可靠性。

通过以上详细的概述,用户可以全面了解0603B153K500CT的性能特点和应用场景,从而更好地选择和使用该产品。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.