WMSIC Electronic Components

Walsin 0603B472K500CT

Model0603B472K500CT
Package0603
Brand(Walsin)
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

18 specifications

Core information

Product name
(Walsin) 0603B472K500CT
Type
WALSIN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
(WALSIN)
Electronic Component
0603B472K500CT
Electronic Component
1
Electronic Component
4.7nF
Package
0603
Electronic Component
SMD Capacitor(MLCC)
Electronic Component
±10%
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0265085254
Electronic Component
X7R
Voltage
50V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

华新科0603B472K500CT陶瓷电容器产品概述

一、产品基本参数梳理

华新科(Walsin)0603B472K500CT是一款多层陶瓷贴片电容器(MLCC),核心参数与型号命名逻辑清晰:

  • 容值与精度:标称容值4.7nF(型号中“472”为容值代码,代表47×10²pF=4700pF),精度±10%(型号中“K”为精度标识);
  • 额定电压:50V直流(型号中“500”为电压代码),满足低压电路的安全工作需求;
  • 温度特性:X7R温度系数(-55℃~+125℃范围内,容值变化≤±15%);
  • 封装尺寸:英制0603(对应公制1608,即1.6mm×0.8mm),体积紧凑适配高密度PCB设计。

二、核心技术特性解析

1. X7R温度稳定性优势

X7R是陶瓷电容中中温稳定型的典型代表,区别于Y5V(高温容值衰减大)等材质:

  • 工作温度范围覆盖工业/消费电子常见场景(如智能手机充电发热、工业车间温度波动);
  • 容值波动极小,避免因温度变化导致滤波、耦合效果下降,提升电路可靠性。

2. 小封装与高集成度适配

0603封装体积仅为1.6mm×0.8mm,厚度约0.8mm,可显著节省PCB空间:

  • 适配智能手机、智能穿戴、小型家电等便携设备的高密度布局;
  • 支持回流焊、波峰焊工艺,与其他贴片元件兼容性强。

3. 高可靠性与环保合规

  • 无极性设计,安装无需区分正负极,简化生产流程;
  • 符合RoHS 2.0、REACH等环保标准,不含铅、镉等有害物质;
  • 华新科成熟的MLCC生产工艺,保证批量产品一致性(容值、电压偏差控制在规格内)。

三、典型应用场景

1. 消费电子领域

  • 智能手机/平板:电源管理模块(PMIC)的高频噪声滤波、音频电路耦合;
  • 智能穿戴:智能手表/手环的传感器供电滤波、蓝牙模块信号去耦;
  • 小型家电:加湿器、智能音箱的控制电路滤波,降低电磁干扰。

2. 工业控制电路

  • 小型PLC:数字输入/输出(I/O)接口滤波,减少环境噪声对信号的干扰;
  • 电机驱动:低压直流电机的软启动滤波,抑制电流突变带来的尖峰电压;
  • 传感器模块:温度、压力传感器的信号耦合,保证弱信号传输稳定。

3. 通信设备

  • 路由器/交换机:以太网端口的共模滤波、电源模块去耦;
  • 物联网终端:低功耗WiFi模块的信号去噪,提升数据传输可靠性。

四、品牌与质量保障

华新科是全球领先的被动元器件制造商,专注MLCC研发生产超过30年:

  • 产品通过ISO 9001、ISO 14001等体系认证,批量供货稳定性强;
  • 针对0603封装系列,提供详细的焊接工艺参数(如回流焊温度曲线),降低生产不良率;
  • 广泛应用于华为、小米、美的等知名品牌的终端产品,市场验证充分。

五、选型与使用注意事项

  1. 电压裕量:实际工作电压建议不超过额定电压的80%(即≤40V),避免过压损坏;
  2. 温度适配:若环境温度长期超过125℃,需替换为X8R(-55℃~+150℃)温度系数的电容;
  3. 焊盘设计:PCB焊盘尺寸需匹配0603封装(建议焊盘长度1.01.2mm,宽度0.60.8mm),避免虚焊;
  4. 批量采购:若月需求超过10k,可联系华新科代理商申请定制化包装(如卷带编带),提升生产效率。

该产品凭借“小体积、稳定温度特性、高可靠性”的综合优势,成为消费电子、工业控制等领域低压滤波/耦合场景的主流选型之一。

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