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Walsin 0805B472K500CT
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- (Walsin) 0805B472K500CT
- Type
- WALSIN
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- (WALSIN)
- Electronic Component
- 0805B472K500CT
- Electronic Component
- 1
- Electronic Component
- 4.7nF
- Package
- 0805
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.034g
- Electronic Component
- 1
- Electronic Component
- BM0227325817
- Electronic Component
- X7R
- Voltage
- 50V
- Electronic Component
- Electronic Component
- Electronic Component
- 4000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
0805B472K500CT 产品概述
一、产品概述
0805B472K500CT 为华新科（Walsin）生产的一款多层陶瓷电容（MLCC），标称电容值 4.7nF（4700pF），初始容差 ±10%（K），额定电压 50V，介质类型 X7R，封装为 0805（2012 公制，约 2.0mm × 1.25mm）。产品描述常见为 “CAP CER 4700PF 50V X7R”，适合表面贴装自动化生产。
二、主要性能特点
- 高密度：X7R 介质在相同体积下可提供较大容值，适合空间受限场合。
- 宽温区稳定性：X7R 的温度特性为 -55°C 至 +125°C 范围内电容变化通常在 ±15% 以内。
- 较高耐压：50V 额定电压适用于中低压电源、模拟信号链路及去耦滤波。
- 封装通用：0805 尺寸兼容业界主流贴片工艺，便于自动化贴装与回流焊。
三、电气与物理参数（关键项）
- 容值：4.7nF（4700pF）
- 容差：±10%（K）
- 额定电压：50V DC
- 介质：X7R（Class II）
- 封装：0805（2012 公制，约 2.0 × 1.25 mm）
- 表面贴装，常见为卷带包装（Tape & Reel）
四、典型应用
- 电源去耦与旁路（DC-DC 输出、LDO 稳压器输入/输出）
- 高频滤波与耦合/旁路网络
- 模拟信号链的滤波与稳定（放大器、采样电路）
- 消费电子、通信设备、工业控制模块等对体积与可靠性有要求的场合
五、设计与使用注意事项
- 电压依赖性：Class II 陶瓷存在显著 DC-bias 效应，工作电压接近额定值时电容会下降，设计时应预留裕量或参照厂方 DC-bias 曲线。
- 温度与老化：X7R 温度稳定性良好但仍有老化与时间漂移现象，长期使用应关注关键回路的容值变化。
- 焊接与机械应力：推荐采用标准回流焊工艺（无铅兼容），避免在焊接或装配过程中对元件施加过大弯曲或应力，以防裂纹导致失效。合理的焊盘形状与焊膏量有助于降低应力。
- 测试与选型：关键电路建议在实际工作电压与温度下测量有效电容与 ESR，以确认满足性能需求。
六、订购与封装信息
典型料号中 “472” 表示 4.7nF，K 表示 ±10% 容差，500 多用于表示 50V 额定（具体编码规则请以华新科最新料号说明为准），后缀 CT 等常表示卷带（Tape & Reel）等包装方式。购买时请确认批次、RoHS 合规性及是否需要特殊筛选（如电容偏差、温漂测试等）。
如需更详细的电气特性曲线（DC-bias、温漂曲线、可靠性试验报告）或推荐 PCB 焊盘尺寸图，可提供进一步支持以协助选型与布局设计。
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